MC9S08GT32ACFBE vs MC9S08AW60CFGE

This in-depth comparison of the MC9S08GT32ACFBE and MC9S08AW60CFGE provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC9S08GT32ACFBE

Freescale Semiconductor

Lifecycle
Active
Stock
5011 PCS
Package
SOT803-2
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MC9S08AW60CFGE

NXP USA Inc.

Lifecycle
Active
Stock
3035 PCS
Package
SOT389-2
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC9S08GT32ACFBE MC9S08AW60CFGE
Series S08 S08
Part Status Active Active
Core Processor S08 S08
Core Size 8-Bit 8-Bit
Speed 40MHz 40MHz
Connectivity I²C, SCI, SPI I²C, SCI, SPI
Peripherals LVD, POR, PWM, WDT LVD, POR, PWM, WDT
Number of I/O 36 34
Program Memory Size 32KB (32K x 8) 60KB (60K x 8)
Program Memory Type FLASH FLASH
RAM Size 2K x 8 2K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V 2.7V ~ 5.5V
Data Converters A/D 8x10b A/D 8x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
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