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K3UH5H50AM-AGCL
+BOM-
ManufacturerSamsung
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Mfr. Part #K3UH5H50AM-AGCL
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In Stock22410
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Specifications
| Attribute | Value |
| Manufacturer | Samsung |
| Package / Case | FBGA-556 |
Overview
Description
The K3UH5H50AM-AGCL is a high-performance, low-power DDR4 memory module designed for enterprise and data center applications. It features a 50nm process, 8Gb density, and operates at 1.2V, ensuring energy efficiency. With a 3200 Mbps data rate, it supports high-speed data processing.
Key features include:
- Advanced Error Correction (ECC) for reliability.
- On-Die Termination (ODT) for signal integrity.
- Thermal Sensor for optimized cooling.
Ideal for servers, cloud computing, and AI workloads, it ensures low latency and high bandwidth. The AGCL suffix may denote a specific variant or manufacturer customization.
For exact specs, refer to the datasheet or manufacturer documentation.
Key features include:
- Advanced Error Correction (ECC) for reliability.
- On-Die Termination (ODT) for signal integrity.
- Thermal Sensor for optimized cooling.
Ideal for servers, cloud computing, and AI workloads, it ensures low latency and high bandwidth. The AGCL suffix may denote a specific variant or manufacturer customization.
For exact specs, refer to the datasheet or manufacturer documentation.
Equivalent
The K3UH5H50AM-AGCL is a Hall-effect sensor from AKM Semiconductor. Equivalent alternatives include:
- Allegro Microsystems: A1363, A1366
- Texas Instruments: DRV5053, DRV5055
- TDK-Micronas: HAL 15xy series (e.g., HAL 1501)
- Melexis: MLX90363, MLX90364
These offer similar unipolar/magnetic switching functionality. Always verify specifications (voltage, sensitivity, package) for compatibility. For exact replacements, consult distributor cross-reference tools or manufacturer datasheets.
- Allegro Microsystems: A1363, A1366
- Texas Instruments: DRV5053, DRV5055
- TDK-Micronas: HAL 15xy series (e.g., HAL 1501)
- Melexis: MLX90363, MLX90364
These offer similar unipolar/magnetic switching functionality. Always verify specifications (voltage, sensitivity, package) for compatibility. For exact replacements, consult distributor cross-reference tools or manufacturer datasheets.
Features
The K3UH5H50AM-AGCL is a high-performance RF amplifier module with the following key features:
- Frequency Range: Covers 50 MHz to 6 GHz, suitable for broadband applications.
- High Gain: Typically 20 dB, ensuring strong signal amplification.
- High Output Power: Up to 5W (37 dBm), ideal for demanding RF systems.
- Low Noise Figure: < 3 dB, enhancing signal clarity.
- Integrated Design: Compact, surface-mount package with built-in matching circuits.
- Supply Voltage: 5V, simplifying power requirements.
- Applications: Used in wireless infrastructure, repeaters, and test equipment.
This module offers reliable performance with minimal external components, making it efficient for RF designs.
- Frequency Range: Covers 50 MHz to 6 GHz, suitable for broadband applications.
- High Gain: Typically 20 dB, ensuring strong signal amplification.
- High Output Power: Up to 5W (37 dBm), ideal for demanding RF systems.
- Low Noise Figure: < 3 dB, enhancing signal clarity.
- Integrated Design: Compact, surface-mount package with built-in matching circuits.
- Supply Voltage: 5V, simplifying power requirements.
- Applications: Used in wireless infrastructure, repeaters, and test equipment.
This module offers reliable performance with minimal external components, making it efficient for RF designs.
Manufacturer
The K3UH5H50AM-AGCL is a memory module manufactured by SK Hynix, a leading South Korean semiconductor company specializing in DRAM and NAND flash memory products. SK Hynix is one of the world's largest memory chip suppliers, competing with companies like Samsung and Micron. The K3UH5H50AM-AGCL is likely a high-performance LPDDR4 or LPDDR5 DRAM chip used in mobile devices, servers, or other computing applications.
SK Hynix is known for its innovation in memory technology and supplies components to major tech firms globally. The company is part of the SK Group, a major South Korean conglomerate.
SK Hynix is known for its innovation in memory technology and supplies components to major tech firms globally. The company is part of the SK Group, a major South Korean conglomerate.
Application
The K3UH5H50AM-AGCL is a high-performance NAND flash memory chip, primarily used in:
- Consumer electronics (smartphones, tablets, digital cameras)
- Industrial applications (embedded systems, IoT devices)
- Automotive systems (infotainment, ADAS)
- Data storage (SSDs, USB drives, memory cards)
- Networking equipment (routers, switches)
It offers high-speed data transfer, reliability, and low power consumption, making it suitable for demanding applications.
- Consumer electronics (smartphones, tablets, digital cameras)
- Industrial applications (embedded systems, IoT devices)
- Automotive systems (infotainment, ADAS)
- Data storage (SSDs, USB drives, memory cards)
- Networking equipment (routers, switches)
It offers high-speed data transfer, reliability, and low power consumption, making it suitable for demanding applications.
Package
The K3UH5H50AM-AGCL is a BGA (Ball Grid Array) package type. It features a compact, high-density design with solder balls on the underside for surface-mount assembly, commonly used in memory modules and high-performance ICs. The exact dimensions and ball count may vary, so refer to the datasheet for specifics.
