K4F6E3S4HM-MGCJ

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K4F6E3S4HM-MGCJ

+BOM

16Gbit 1.1V 1.866GHz LPDDR4 SDRAM FBGA-200 Memory (ICs) RoHS

  • ManufacturerSamsung

  • Mfr. Part #K4F6E3S4HM-MGCJ

  • In Stock21861

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Specifications

Attribute Value
Packaging FBGA-200
Clock Frequency 1.866GHz
Memory Format LPDDR4 SDRAM
Memory Size 16Gbit
Operating Temperature -25℃~+85℃
Voltage - Supply 1.1V

Overview

Description

"K4F6E3S4HM-MGCJ" appears to be a complex alphanumeric code or identifier, which could relate to various contexts such as a product model, a license key, a cryptographic identifier, or a system designation. Without specific context, it's challenging to determine its exact nature.
In general, such codes are often used in the following contexts:
1. Product Identification: It could represent a specific version of a product, like electronics or software, helping in inventory management or customer support.
2. Cryptography: In cryptographic applications, such identifiers may refer to keys or hashes used for securing data.
3. Licensing: Software programs might use similar codes as a part of their licensing mechanism to validate legitimate usage.
4. Database or System Identifier: It might be an internal reference in a database or system to uniquely identify a record or entity.
Understanding the context in which "K4F6E3S4HM-MGCJ" is used is essential for identifying its specific purpose and relevance. If more details are available, it would be easier to provide a precise explanation.

Equivalent

The K4F6E3S4HM-MGCJ is a Samsung LPDDR4 DRAM chip. Equivalent products would include other LPDDR4 DRAM chips from manufacturers like Micron, SK Hynix, or Kingston. Specific models depend on capacity, speed, and package form factors, so it's best to compare technical specifications directly, such as density, bandwidth, and power efficiency. Always ensure compatibility with your specific device or application.

Pinout

The K4F6E3S4HM-MGCJ is a mobile LPDDR3 DRAM chip produced by Samsung. It typically comes in a 178-ball FBGA (Fine-Pitch Ball Grid Array) package. The primary function of this DRAM chip is to provide high-speed, energy-efficient memory for mobile devices such as smartphones and tablets.
LPDDR3 (Low Power Double Data Rate 3) is designed to offer improvements in power consumption and performance compared to its predecessors, making it suitable for use in mobile applications where battery life and thermal efficiency are crucial. The K4F6E3S4HM-MGCJ supports features like deep power-down mode, temperature-compensated self-refresh, and partial array self-refresh, enhancing its power-saving capabilities.

Manufacturer

The K4F6E3S4HM-MGCJ is a memory chip manufactured by Samsung Electronics. Samsung Electronics is a South Korean multinational company that is a part of the larger Samsung Group conglomerate. It is one of the world's leading technology companies, specializing in the design, manufacture, and sale of a wide range of consumer electronics and technology products, including semiconductors, mobile phones, televisions, and home appliances.
Samsung Electronics is particularly recognized for its significant role in the semiconductor industry, where it produces a variety of components such as memory chips, microprocessors, and display technologies. The company is known for its innovation and technological advancements, making it a dominant player in the global electronics market. It operates on a large scale with activities spanning research and development, manufacturing, and sales, serving both consumer and enterprise markets worldwide.

Package

The package type code K4F6E3S4HM-MGCJ is specific to Samsung's semiconductor products, particularly memory solutions. This code typically represents a particular configuration and packaging type for memory chips, such as DRAM or NAND flash, but specific details would require consulting Samsung's product documentation or contacting them directly for precise information.

Frequently Asked Questions


Q: What is the memory density of the K4F6E3S4HM-MGCJ?
A: It features a 16Gbit memory size, ideal for high-density mobile and embedded applications.


Q: What type of memory interface does this component use?
A: It is an LPDDR4 SDRAM, supporting high-speed data transfer with a 1.866GHz clock frequency.


Q: What is the operating voltage requirement for this chip?
A: It operates at a standard LPDDR4 supply voltage of 1.1V, helping to reduce power consumption.


Q: What is the operating temperature range of the K4F6E3S4HM-MGCJ?
A: It is specified for an industrial temperature range of -25°C to +85°C, suitable for harsh environments.


Q: Is this component compatible with high-speed design requirements?
A: Yes, with a 1.866GHz clock rate, it meets the performance needs of modern high-bandwidth computing systems.


Q: What package type is used for this LPDDR4 memory?
A: It comes in a FBGA-200 package, a compact form factor for space-constrained PCB layouts.


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