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MT29F4G01ABBFDWB-IT:F
+BOMIC FLASH 4GBIT SPI 83MHZ 8UPDFN
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ManufacturerMicron Technology Inc.
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Mfr. Part #MT29F4G01ABBFDWB-IT:F
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In Stock2153
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Specifications
| Attribute | Value |
| Part Status | Active |
| Base Product Number | MT29F4G01 |
| Digi Key Programmable | Not Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND (SLC) |
| Memory Size | 4Gbit |
| Memory Organization | 4G x 1 |
| Memory Interface | SPI |
| Clock Frequency | 83 MHz |
| Voltage - Supply | 1.7V ~ 1.95V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 8-UDFN |
| Supplier Device Package | 8-UPDFN (8x6) (MLP8) |
| Packaging | Tray |
Overview
Description
Typically used in applications such as embedded systems, consumer electronics, and industrial devices, this NAND Flash chip operates efficiently in a wide range of temperatures (-40°C to +85°C), making it suitable for industrial environments. It boasts a small package size, enhancing its utility in space-constrained applications.
Key features include a fast read/write speed, robust data retention, and resistance to wear, often augmented by error-correcting code (ECC) capabilities to ensure data integrity. The interface is compatible with various controllers, which facilitates integration in diverse systems. Overall, the MT29F4G01ABBFDWB-IT:F is valued for its balance of performance, reliability, and capacity.
Equivalent
Features
Key features of the MT29F4G01ABBFDWB-IT:F include:
- A typical page size of 2,112 bytes, with 2,048 bytes for data and 64 bytes for spare area.
- Block size of 64 pages, amounting to 128KB.
- Interface that supports asynchronous I/O operations.
- Advanced wear-leveling and error correction capabilities to enhance data integrity and longevity.
- Compatibility with standard NAND Flash protocols, enabling ease of integration into various systems.
- Low power consumption, making it suitable for battery-operated devices.
These features make the MT29F4G01ABBFDWB-IT:F ideal for industrial, automotive, and consumer applications where reliable data storage and performance are required.
Pinout
The chip features 4Gb (gigabit) of storage capacity organized in a x8 configuration, meaning the data bus is 8 bits wide. The pins include power supply inputs, ground pins, data bus pins (I/O pins), control pins (such as Chip Enable, Write Enable, Read Enable), and address pins among others. These pins are used to control the read/write operations, manage power, and communicate data to and from the memory.
For specific pin functions and ordering, you would need to refer to the datasheet or technical documentation provided by Micron for exact details.
Manufacturer
Application
1. Embedded Systems: Used for storing firmware and data in devices such as industrial controllers and consumer electronics.
2. Mobile Devices: Provides storage solutions for smartphones, tablets, and wearable technology.
3. Automotive Systems: Utilized in infotainment systems, navigation, and other in-car electronics.
4. Networking Equipment: Supports data storage for routers, switches, and other networking devices.
5. Solid-State Drives (SSDs): Acts as a key component in SSDs for faster data access and storage efficiency.
These applications benefit from the chip's reliability, durability, and high storage density.
Package
Frequently Asked Questions
Q: What is the memory density and organization of the MT29F4G01ABBFDWB-IT:F?
A: It is a 4Gbit NAND Flash organized as 4G x 1 bit, using a single-level cell (SLC) architecture for improved endurance.
Q: What is the operating voltage range for this device?
A: The voltage supply range is 1.7V to 1.95V, suitable for low-power applications requiring a 1.8V rail.
Q: Does this part support a standard serial peripheral interface (SPI)?
A: Yes, it features an SPI memory interface, enabling easy integration with microcontrollers and reducing pin count requirements.
Q: What is the maximum clock frequency for SPI communication?
A: The SPI clock frequency operates up to 83 MHz, allowing for high-speed data transfer in read and write operations.
Q: What is the operating temperature range for this component?
A: It is rated for an industrial temperature range of -40°C to +85°C (TA), ensuring reliability in harsh environments.
Q: In which package is this memory device available?
A: It comes in an 8-pin UDFN package (8-UPDFN, 8x6mm, MLP8), designed for surface mount assembly with a compact footprint.
Q: What type of memory technology is used in this part?
A: It utilizes FLASH - NAND (SLC) technology, providing non-volatile storage with high endurance and fast program/erase cycles.