Images are for reference only
MT29F4G08ABADAWP-IT:D
+BOMIC FLASH 4GBIT PARALLEL 48TSOP I
-
ManufacturerMicron Technology Inc.
-
Mfr. Part #MT29F4G08ABADAWP-IT:D
-
In Stock5366
365 Days Quality Guarantee
7*24 hours service quarantee
90-day after-sales guarantee
Genuine Product Guarantee
Specifications
| Attribute | Value |
| Part Status | Last Time Buy |
| Base Product Number | MT29F4G08 |
| Digi Key Programmable | Not Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND |
| Memory Size | 4Gbit |
| Memory Organization | 512M x 8 |
| Memory Interface | Parallel |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 48-TFSOP (0.724", 18.40mm Width) |
| Supplier Device Package | 48-TSOP I |
| Packaging | Tray |
Overview
Description
The "IT" in the part number indicates that this chip is suitable for industrial temperature ranges, making it reliable for use in more demanding environments. It operates with a typical voltage of 3.3V, and the "DAWP" denotes its package type, which is typically a TSOP or similar form factor, designed for ease of integration into various electronic designs.
Overall, the MT29F4G08ABADAWP-IT:D is a robust memory solution for applications that require reliable performance in a wide range of environmental conditions, offering a balance between cost, capacity, and durability.
Equivalent
1. Samsung K9K4G08U0D
2. Toshiba TC58NVG4D2FTA00
3. Hynix H27U4G8F2BTR-BC
4. SanDisk SDTNQGAMA-004G
These chips have similar storage capacities and interfaces, making them potential substitutes depending on specific application requirements. Always verify compatibility regarding package type, temperature range, and performance specifications.
Features
1. Capacity: It offers a memory capacity of 4Gb (Gigabits).
2. Architecture: The device is organized into a single-level cell (SLC) structure, providing high reliability and endurance.
3. Package: It is typically available in a TSOP (Thin Small-Outline Package), which is suitable for a variety of embedded applications.
4. Interface: Features an 8-bit interface that supports high-speed data transfers.
5. Performance: It supports fast read and write operations, enhancing the efficiency of data handling.
6. Temperature Range: Designed to operate in industrial temperature ranges, making it suitable for harsh environments.
7. Endurance: Has high endurance levels, allowing for numerous program and erase cycles, which is ideal for applications requiring frequent data updates.
8. ECC Support: Built-in error correction code (ECC) to ensure data integrity.
9. Low Power Consumption: Efficient power usage for applications needing energy efficiency.
These features make it suitable for use in industrial, automotive, and other demanding environments.
Pinout
Here is a brief overview of the key pin functions:
1. I/O Pins (I/O0 - I/O7): Used for data input/output.
2. CLE (Command Latch Enable): Used to latch command inputs.
3. ALE (Address Latch Enable): Used to latch address inputs.
4. CE# (Chip Enable): Activates the chip.
5. RE# (Read Enable): Controls data reading from the chip.
6. WE# (Write Enable): Controls data writing to the chip.
7. WP# (Write Protect): Protects the memory from being written.
8. R/B# (Ready/Busy): Indicates the status of the device.
9. VCC: Power supply input.
10. VSS: Ground.
This chip is used for data storage and supports typical NAND flash operations such as reading, writing, and erasing data. It is commonly used in various electronic devices where non-volatile storage is required.
Manufacturer
Application
1. Consumer Electronics: Used in devices like smartphones, tablets, and cameras for data storage.
2. Industrial Applications: Provides reliable storage solutions for embedded systems, industrial computers, and automation equipment.
3. Automotive: Utilized in infotainment systems, navigation systems, and advanced driver-assistance systems (ADAS).
4. Networking: Employed in routers, switches, and other networking equipment for storing configurations and log data.
5. IoT Devices: Serves as non-volatile storage in IoT devices for firmware and sensor data logging.
These varied applications leverage the chip's high-density storage and durability.
Package
Frequently Asked Questions
Q: What type of memory and technology does the MT29F4G08ABADAWP-IT:D use?
A: It is a Non-Volatile memory using FLASH - NAND technology, offering 4Gbit capacity organized as 512M x 8 bits.
Q: What is the operating voltage range for this NAND Flash device?
A: The device operates within a supply voltage range of 2.7V to 3.6V.
Q: What is the operating temperature range of this component?
A: It is rated for industrial temperature operation from -40°C to +85°C (TA).
Q: What is the memory interface and package type for this part?
A: It uses a Parallel memory interface and comes in a 48-TFSOP (18.40mm Width) surface-mount package, specifically a 48-TSOP I.
Q: Is the MT29F4G08ABADAWP-IT:D suitable for new designs?
A: No, its Part Status is "Last Time Buy," meaning it is not recommended for new designs and has a limited order window.
Q: What mounting type is required for this component?
A: It requires Surface Mount (SMD) technology for assembly onto a PCB.