SDINBDG4-8G-XI1

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SDINBDG4-8G-XI1

+BOM

eMMC Use XI2 SKU for new design - Industrial Extended Temp -40C+85C eMMC 5.1 HS400

  • ManufacturerWestern Design Center (WDC)

  • Mfr. Part #SDINBDG4-8G-XI1

  • In Stock11367

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Specifications

Attribute Value

Overview

Description

The SDINBDG4-8G-XI1 is likely a model number for a specific type of NAND flash storage device, commonly used in electronic devices such as smartphones, tablets, and other portable electronics for data storage. This specific model might refer to certain technical specifications such as its storage capacity (8GB), form factor, interface type, and performance characteristics.
Manufactured by companies like SanDisk, these embedded flash drives typically offer reliable data retention, fast read/write speeds, and durability suitable for a range of consumer and industrial applications. They are designed to function efficiently under various environmental conditions and are often integrated directly onto the circuit boards of devices to save space and enhance performance.
In summary, the SDINBDG4-8G-XI1 represents a specific NAND flash storage solution tailored for efficient data management in compact electronic devices, balancing performance and reliability. For precise details, including its compatibility and full technical specifications, consulting the manufacturer's datasheet or product documentation would be necessary.

Equivalent

The SDINBDG4-8G-XI1 is an 8GB e.MMC memory chip by SanDisk. Equivalent products may include similar e.MMC chips from other manufacturers, such as Samsung's eMMC 5.1 series (e.g., KLM8G1GETF-B041), Kingston's eMMC solutions, or Micron's e.MMC lineup. Ensure compatibility by comparing key specifications like capacity, interface version, and temperature range. Always verify with the manufacturer for the most accurate compatibility.

Features

The SDINBDG4-8G-XI1 is a NAND flash storage device typically used in embedded systems and applications. While specific features and specifications can vary, typical characteristics of NAND flash memory like this one include:
1. Capacity: 8GB of storage, suitable for various applications requiring moderate data storage capacity.
2. Interface: Likely utilizes an e.MMC interface, which provides a standard, high-speed interface for integration into systems.
3. Performance: Offers reliable read/write speeds, optimized for embedded applications, though exact data rates depend on specific system integration.
4. Durability: Designed to handle frequent read/write cycles, ensuring longevity and reliability in embedded environments.
5. Temperature Range: Often supports a wide operating temperature range, making it suitable for industrial use.
6. Data Integrity: Includes error correction features to maintain data integrity and prevent corruption.
7. Size/Form Factor: Compact design suitable for space-constrained applications.
This type of NAND flash memory is commonly used in consumer electronics, automotive systems, industrial devices, and other applications requiring embedded storage solutions. For precise specifications, consulting the datasheet from the manufacturer, SanDisk, is recommended.

Pinout

The SDINBDG4-8G-XI1 is an e.MMC (embedded MultiMediaCard) memory solution from SanDisk, part of the iNAND series. This component typically comes in a BGA (Ball Grid Array) package, which is commonly used for high-density memory devices. The standard pin count for e.MMC devices like this one is usually 153 or 169 pins, depending on the specific configuration and version.
The primary function of the SDINBDG4-8G-XI1 is to provide non-volatile storage with a capacity of 8GB, suitable for use in portable devices such as smartphones, tablets, and other embedded systems. It integrates NAND flash memory with an MMC interface, which simplifies the integration by offering a complete storage solution that manages the NAND and provides a standardized interface to the host processor.
For detailed and specific technical information, including exact pin count and configuration, the manufacturer's datasheet or technical documentation should be referred to.

Manufacturer

The SDINBDG4-8G-XI1 is a product manufactured by Western Digital Corporation. Western Digital is a prominent American company specializing in the design, manufacture, and sale of data technology products, particularly storage devices and solutions. They produce a wide range of products, including hard drives, solid-state drives (SSDs), and memory cards, among others. Western Digital is known for its innovation and leadership in the data storage industry, catering to both consumer and enterprise markets.

Application

The SDINBDG4-8G-XI1 is a specific model of embedded eMMC (embedded MultiMediaCard) storage module. Its application areas include:
1. Consumer Electronics: Used in smartphones, tablets, and digital cameras for efficient data storage and retrieval.
2. Industrial Applications: Suitable for use in embedded systems and industrial automation for robust data storage.
3. Automotive Systems: Employed in infotainment systems and navigation units due to its reliability and durability.
4. IoT Devices: Provides storage solutions for Internet of Things devices requiring compact and efficient memory.
5. Wearables: Integrated into wearable technology for compact data storage needs.
These application areas benefit from the module's efficient performance, durability, and space-saving design.

Package

The SDINBDG4-8G-XI1 is a type of embedded MultiMediaCard (eMMC) storage package. It typically comes in a BGA (Ball Grid Array) form factor, which is a surface-mount chip package used for mounting integrated circuits. eMMC storage is commonly used in mobile devices and embedded systems for its compact size and efficient performance.

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