5CEBA2U15I7N vs 5CEBA5U19C8N

This in-depth comparison of the 5CEBA2U15I7N and 5CEBA5U19C8N provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Compatible functional replacement candidate

The 5CEBA2U15I7N and 5CEBA5U19C8N are both Intel Cyclone V GX FPGA devices sharing the same core architecture and 28 nm process, but they differ in logic density, package footprint, and operating temperature grade. The 5CEBA5U19C8N offers higher logic capacity and a larger package, while the 5CEBA2U15I7N provides a compact industrial-grade option. Direct substitution requires validation of logic utilization, pinout compatibility, and thermal conditions before adoption.

Logic Density Validation required
Package Type Not compatible
Operating Temperature Not compatible
Core Architecture High match

Parts at a glance

Part A

5CEBA2U15I7N

Intel

Lifecycle
Active
Stock
3669 PCS
Package
BGA-324
Series
Embedded - FPGAs (Field Programmable Gate Array)
Part B

5CEBA5U19C8N

Intel

Lifecycle
Active
Stock
6299 PCS
Package
FBGA-484
Series
Embedded - FPGAs (Field Programmable Gate Array)

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter 5CEBA2U15I7N 5CEBA5U19C8N Why it matters
Family / Series Cyclone V E Cyclone V E Both belong to the Cyclone V E family, so they share the same architecture and IP ecosystem, which simplifies design migration.
Logic Elements (LE) 25,000 77,000 Logic capacity determines how much custom digital logic can be implemented; the larger device supports significantly more complex designs.
Adaptive Logic Modules (ALM) 9,430 29,080 ALMs are the fundamental building blocks of the FPGA fabric; more ALMs allow more logic functions to be mapped.
Embedded Memory (M10K) 1,400 Kb 4,460 Kb On-chip memory is used for buffering, FIFOs, and data storage; more memory supports larger data sets and deeper pipelines.
18x18 Multipliers 50 150 Hard multipliers accelerate DSP operations; the count directly affects signal processing throughput.
Maximum User I/O 240 240 I/O count determines how many external interfaces and peripherals can be connected simultaneously.
Package UBGA-324 UBGA-484 Package type and pin count affect PCB layout, thermal performance, and mechanical compatibility.
Operating Temperature -40°C to 100°C (Industrial) 0°C to 85°C (Commercial) Temperature grade determines suitability for harsh environments; industrial parts are required for wide-temperature applications.
Speed Grade 7 (Fastest) 8 (Standard) Speed grade affects maximum operating frequency and timing closure; a faster grade can enable higher clock rates.
Core Supply Voltage 1.1 V 1.1 V Core voltage must match the board power design; identical values mean the same power rail can be reused.

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification 5CEBA2U15I7N 5CEBA5U19C8N
Supplier - Intel
Series Cyclone® V E Cyclone® V E
Part Status Active Active
Number of LABs/CLBs 9434 29080
Number of Logic Elements/Cells 25000 77000
Total RAM Bits 2002944 5001216
Number of I/O 176 224
Voltage - Supply 1.07V ~ 1.13V 1.07V ~ 1.13V
Mounting Type Surface Mount Surface Mount
Operating Temperature -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ)

Frequently asked questions

What are the key differences between the 5CEBA2U15I7N and the 5CEBA5U19C8N?

The 5CEBA2U15I7N is a Cyclone V E FPGA with 25,000 logic elements in a 15x15 mm UBGA package, rated for industrial temperature range (I7). The 5CEBA5U19C8N is a Cyclone V E FPGA with 77,000 logic elements in a 19x19 mm UBGA package, rated for commercial temperature range (C8). They differ in logic density, package size, and temperature grade.

Are the 5CEBA2U15I7N and 5CEBA5U19C8N pin-compatible?

No. The 5CEBA2U15I7N uses a 15x15 mm UBGA package, while the 5CEBA5U19C8N uses a 19x19 mm UBGA package. The different package sizes and ball counts result in different pinouts and PCB land patterns, so they are not pin-compatible.

Can the 5CEBA2U15I7N be used as a direct substitute for the 5CEBA5U19C8N?

No. The 5CEBA2U15I7N has 25,000 logic elements, while the 5CEBA5U19C8N has 77,000 logic elements. The lower logic density of the 5CEBA2U15I7N may not accommodate a design that requires the resources of the 5CEBA5U19C8N. Additionally, the package and temperature grade differences prevent a direct substitution without design changes.

What are the operating temperature ranges for these two FPGAs?

The 5CEBA2U15I7N is rated for the industrial temperature range, typically -40°C to 100°C junction temperature (I7 grade). The 5CEBA5U19C8N is rated for the commercial temperature range, typically 0°C to 85°C junction temperature (C8 grade). The industrial-grade part is suitable for harsher environments.

Do both devices belong to the same FPGA family?

Yes. Both the 5CEBA2U15I7N and the 5CEBA5U19C8N are members of the Intel (formerly Altera) Cyclone V E FPGA family. They share the same architecture, IP support, and development tools, but differ in logic density, package, and temperature grade.

Which device offers higher logic density and embedded memory?

The 5CEBA5U19C8N offers higher logic density with 77,000 logic elements compared to 25,000 logic elements in the 5CEBA2U15I7N. The 5CEBA5U19C8N also provides more embedded memory and DSP blocks, making it suitable for more complex designs.

Are the power supply requirements the same for both FPGAs?

Both devices are Cyclone V E FPGAs and typically require core voltages of 1.1 V and I/O voltages that depend on the configured I/O standards. However, exact power supply requirements, including current consumption, differ based on logic utilization and operating conditions. Designers should consult the respective device datasheets and pin-out files for precise power specifications.

What package types are used by the 5CEBA2U15I7N and 5CEBA5U19C8N?

The 5CEBA2U15I7N is packaged in a 15x15 mm UBGA (Ultra FineLine BGA) with 324 balls. The 5CEBA5U19C8N is packaged in a 19x19 mm UBGA with 484 balls. The different ball counts and dimensions affect PCB layout and routing.