5CEBA4F17C8N
Intel
- Lifecycle
- Active
- Stock
- 2430 PCS
- Package
- FBGA-256
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
This in-depth comparison of the 5CEBA4F17C8N and 5CEBA2F17C6N provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.
Replacement verdict
The 5CEBA2F17C6N is a viable functional replacement candidate for the 5CEBA4F17C8N in space-constrained designs where reduced logic density and lower speed grade are acceptable. Both devices share the same 256-ball FBGA package and Cyclone V FPGA architecture, ensuring footprint compatibility. However, the 5CEBA2F17C6N offers approximately half the logic elements and a slower speed grade, which may impact timing closure and resource utilization. Validation is required to confirm that the reduced logic capacity and performance meet application requirements.
Intel
Intel
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEBA4F17C8N | 5CEBA2F17C6N | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 49,000 | 25,000 | Determines the amount of programmable logic available; a design that fits in the larger device may not fit in the smaller one, affecting functional substitutability. |
| Total Embedded RAM | 3,080 kbit | 1,540 kbit | On-chip memory capacity affects buffering, FIFO depth, and data storage; insufficient RAM can prevent a design from being ported between devices. |
| Embedded 18x18 Multipliers | 132 | 66 | DSP resources limit arithmetic throughput; fewer multipliers can bottleneck signal-processing or math-intensive designs. |
| Maximum User I/O | 128 | 128 | I/O count determines how many external signals can be interfaced; matching counts supports pin-compatible substitution. |
| Speed Grade | 8 | 6 | Speed grade affects maximum operating frequency and timing closure; a slower grade may not meet the same performance targets. |
| Package | FBGA-256 | FBGA-256 | Package type and footprint must match for physical board compatibility and drop-in replacement. |
| Operating Temperature Range | 0°C to 85°C (Commercial) | 0°C to 85°C (Commercial) | Temperature grade determines suitability for the target environment; mismatches can cause reliability issues. |
| Core Supply Voltage | 1.1 V | 1.1 V | Core voltage must match the board power design; differing requirements would need regulator changes. |
| Family | Cyclone V E | Cyclone V E | Same device family ensures compatible architecture, toolchain support, and IP reuse. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 5CEBA4F17C8N | 5CEBA2F17C6N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 18480 | 9434 |
| Number of Logic Elements/Cells | 49000 | 25000 |
| Total RAM Bits | 3464192 | 2002944 |
| Number of I/O | 128 | 128 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
The 5CEBA4F17C8N and 5CEBA2F17C6N are both Intel (formerly Altera) Cyclone V E series FPGAs in the same 256-pin FBGA package (17 mm x 17 mm). The primary differences are logic density and speed grade: the 5CEBA4F17C8N offers approximately 49,000 logic elements (LEs) with a speed grade of 8, while the 5CEBA2F17C6N offers approximately 25,000 LEs with a faster speed grade of 6. The 5CEBA4F17C8N also provides more embedded memory, multipliers, and transceiver resources than the 5CEBA2F17C6N.
Yes. Both devices are offered in the same 256-pin FineLine BGA (FBGA) package with the same 17 mm x 17 mm body size and identical pinout for the Cyclone V E family. However, pin-compatibility does not guarantee functional equivalence; designers must verify that all I/O assignments, power pins, and configuration pins meet the target design requirements before substituting one for the other.
Not directly. Although both devices share the same package and pinout, the 5CEBA4F17C8N has higher logic density (approximately 49,000 LEs vs. 25,000 LEs) and a different speed grade (8 vs. 6). A design compiled for the 5CEBA4F17C8N may exceed the resources of the 5CEBA2F17C6N, and timing closure may differ due to the speed grade change. The design must be recompiled and validated for the target device before substitution.
The 5CEBA4F17C8N uses speed grade 8, while the 5CEBA2F17C6N uses speed grade 6. In Intel FPGA nomenclature, a lower speed grade number indicates a faster device. Therefore, the 5CEBA2F17C6N has faster maximum operating frequencies and tighter timing specifications than the 5CEBA4F17C8N, even though it has lower logic density.
Both devices belong to the Cyclone V E family and support standard configuration schemes such as active serial, passive serial, and JTAG. However, the 5CEBA4F17C8N includes more transceiver channels and higher-speed transceiver capabilities than the 5CEBA2F17C6N. Designers should consult the respective device datasheets to confirm the exact transceiver count and supported data rates for each part number.
The 5CEBA4F17C8N is more suitable for high-logic-density applications because it provides approximately 49,000 logic elements, significantly more than the approximately 25,000 logic elements of the 5CEBA2F17C6N. The 5CEBA4F17C8N also offers more embedded memory blocks and digital signal processing (DSP) blocks, making it better suited for complex designs that require greater resource counts.
Yes. The 5CEBA4F17C8N generally consumes more power than the 5CEBA2F17C6N due to its higher logic density and larger resource count. However, actual power consumption depends on the specific design, clock frequencies, I/O usage, and operating conditions. Intel provides the Early Power Estimator (EPE) and PowerPlay Power Analyzer tools to estimate power for each device accurately.
Both the 5CEBA4F17C8N and 5CEBA2F17C6N are offered in a 256-pin FBGA package measuring 17 mm x 17 mm. The "C" in the part number indicates commercial temperature grade, typically 0°C to 85°C junction temperature. Industrial and automotive temperature grades are available under different part number suffixes. Always verify the exact temperature grade from the manufacturer datasheet for the specific ordering code.