Part A
5CEBA4F23C7N
Intel
- Lifecycle
- Active
- Stock
- 1344 PCS
- Package
- FBGA-484
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 5CEBA4F23C7N and 5CEBA4U19C7N are both Intel Cyclone V FPGA devices sharing the same logic density, speed grade, and temperature grade, making them functionally interchangeable at the silicon level. However, they differ in package type and pin count, which affects PCB footprint and pinout compatibility. Designers must verify board-level mechanical and routing compatibility before substituting one for the other.
Logic Density
High match
Speed Grade
High match
Operating Temperature
High match
Package Type
Not compatible
Parts at a glance
Part B
5CEBA4U19C7N
Intel
- Lifecycle
- Active
- Stock
- 7845 PCS
- Package
- FBGA-484
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEBA4F23C7N | 5CEBA4U19C7N | Why it matters |
|---|---|---|---|
| Package / Case | FBGA-484 | UBGA-484 | The physical package and ball pitch determine PCB footprint, routing density, and whether the two devices are drop-in compatible on an existing board. |
| Number of I/Os | 224 | 224 | Available user I/O count defines how many external signals the FPGA can interface with, directly affecting system connectivity. |
| Logic Elements (LEs) | 49000 | 49000 | Logic element count is the primary measure of programmable logic capacity and determines whether a design fits within the device. |
| Total RAM Bits | 3036160 | 3036160 | Embedded memory capacity affects buffering, FIFO depth, and on-chip data storage capability for the design. |
| Number of LABs / CLBs | 18480 | 18480 | Logic array block count reflects the granularity of the programmable fabric and influences placement and routing efficiency. |
| Operating Temperature Range | 0°C to 85°C (TJ) | 0°C to 85°C (TJ) | The temperature grade determines the environments in which the device can reliably operate and affects thermal design requirements. |
| Supply Voltage | 1.07V to 1.13V | 1.07V to 1.13V | Core supply voltage must match the board power design; mismatches can cause malfunction or damage. |
| Mounting Type | Surface Mount | Surface Mount | Mounting type determines the assembly process and whether the part is compatible with the intended PCB manufacturing flow. |
| Speed Grade | 7 | 7 | Speed grade indicates the maximum achievable clock frequency and timing closure margin for the design. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEBA4F23C7N | 5CEBA4U19C7N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 18480 | 18480 |
| Number of Logic Elements/Cells | 49000 | 49000 |
| Total RAM Bits | 3464192 | 3464192 |
| Number of I/O | 224 | 224 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the 5CEBA4F23C7N and 5CEBA4U19C7N devices?
Both are Intel (formerly Altera) Cyclone V E series field-programmable gate arrays (FPGAs). The 5CEBA4F23C7N is a 23 mm FBGA-packaged device, while the 5CEBA4U19C7N is a 19 mm UBGA-packaged device. Both share the same 5CEBA4 core logic density and C7 speed grade.
Do the 5CEBA4F23C7N and 5CEBA4U19C7N have the same logic density and resources?
Yes. Both devices are built on the same Cyclone V E 5CEBA4 die, offering identical adaptive logic module (ALM) counts, embedded memory, and DSP block resources. The primary differences are package type, pin count, and available user I/O.
What package types do the 5CEBA4F23C7N and 5CEBA4U19C7N use?
The 5CEBA4F23C7N uses a 484-pin FineLine BGA (FBGA) package measuring 23 mm x 23 mm. The 5CEBA4U19C7N uses a 484-pin Ultra FineLine BGA (UBGA) package measuring 19 mm x 19 mm. Both are lead-free and RoHS-compliant.
Are the 5CEBA4F23C7N and 5CEBA4U19C7N pin-compatible?
No. Although both are 484-pin packages, the FBGA and UBGA have different ball pitches, land patterns, and mechanical dimensions. The 5CEBA4F23C7N has a 1.0 mm ball pitch, while the 5CEBA4U19C7N has a 0.8 mm ball pitch. They are not drop-in replacements for each other.
What is the difference in user I/O count between the 5CEBA4F23C7N and 5CEBA4U19C7N?
The 5CEBA4F23C7N provides up to 224 user I/O pins, while the 5CEBA4U19C7N provides up to 224 user I/O pins as well. However, the actual usable I/O may vary based on the specific I/O bank assignments and package routing. Designers should verify the pinout in the respective device pin-out files.
Can the 5CEBA4U19C7N be used as a direct substitute for the 5CEBA4F23C7N?
No. Because the packages differ in ball pitch, footprint, and thermal characteristics, a direct substitution is not possible without a PCB redesign. The 5CEBA4U19C7N is intended for space-constrained designs, while the 5CEBA4F23C7N offers a larger footprint with potentially better thermal dissipation.
Do both devices support the same configuration and transceiver options?
Both devices support the same configuration schemes, including active serial, passive serial, and JTAG. However, the Cyclone V E 5CEBA4 device does not include high-speed transceivers. Neither the 5CEBA4F23C7N nor the 5CEBA4U19C7N features integrated transceivers; they are general-purpose FPGAs with logic, memory, and DSP resources only.
What is the operating temperature range for the 5CEBA4F23C7N and 5CEBA4U19C7N?
Both devices are specified for commercial temperature range (C7 speed grade) with a junction temperature range of 0°C to 85°C. Industrial and automotive temperature grades are available under different ordering codes, but the C7N suffix indicates commercial temperature.
Which device is more suitable for compact, high-density PCB layouts?
The 5CEBA4U19C7N is more suitable for compact designs due to its 19 mm x 19 mm UBGA package with 0.8 mm ball pitch, which saves significant board area compared to the 23 mm x 23 mm FBGA of the 5CEBA4F23C7N. However, the finer pitch may require more advanced PCB fabrication and assembly capabilities.