5CEBA4F23C8N
Intel
- Lifecycle
- Active
- Stock
- 6956 PCS
- Package
- FBGA-484
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
This in-depth comparison of the 5CEBA4F23C8N and 5CEBA2F17C7N provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.
Replacement verdict
The 5CEBA4F23C8N and 5CEBA2F17C7N are both Intel Cyclone V FPGAs sharing the same core architecture, logic cell structure, and 28 nm process technology, making them functionally related candidates. However, they differ in logic density, package footprint, and speed grade, so the 5CEBA2F17C7N can only serve as a replacement for the 5CEBA4F23C8N when the reduced logic capacity, smaller I/O count, and tighter package dimensions are acceptable for the target design. Designers must validate resource utilization, pinout compatibility, and timing closure before committing to this substitution.
Intel
Intel
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEBA4F23C8N | 5CEBA2F17C7N | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 49000 | 25000 | Logic capacity determines how much custom digital logic can be implemented; a large mismatch prevents direct substitution for complex designs. |
| Total RAM Bits | 3036160 | 1382400 | Embedded memory affects buffering, FIFO depth, and data storage capability; designs relying on larger memory cannot fit in the smaller device. |
| Number of I/Os | 224 | 128 | I/O count limits how many external signals can be interfaced; fewer pins may make the smaller device incompatible with the board layout. |
| Package / Case | 484-FBGA (23x23) | 256-FBGA (17x17) | Physical footprint and ball pitch must match the PCB land pattern; different packages are not drop-in compatible. |
| Operating Temperature Range | 0°C to 85°C (Commercial) | 0°C to 85°C (Commercial) | Temperature grade affects reliability in the target environment; both are commercial grade here, so this parameter is equivalent. |
| Supply Voltage - Core | 1.07V to 1.13V | 1.07V to 1.13V | Core voltage must match the board power design; identical requirements mean the same regulator can be used. |
| Speed Grade | 8 | 7 | Speed grade determines maximum operating frequency and timing closure; a slower grade may fail timing in designs tuned for a faster device. |
| Number of LABs / CLBs | 1848 | 943 | Logic array blocks define the granularity of programmable logic resources; fewer blocks reduce achievable design complexity. |
| Embedded Multipliers (18x18) | 132 | 66 | Dedicated multipliers accelerate DSP and arithmetic functions; halving them limits signal processing throughput. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 5CEBA4F23C8N | 5CEBA2F17C7N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 18480 | 9434 |
| Number of Logic Elements/Cells | 49000 | 25000 |
| Total RAM Bits | 3464192 | 2002944 |
| Number of I/O | 224 | 128 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
The 5CEBA4F23C8N is a Cyclone V E FPGA with 49,000 logic elements, 2,910 Kbits of embedded memory, and 224 18x18 multipliers in a 484-pin FBGA package. The 5CEBA2F17C7N is a Cyclone V E FPGA with 25,000 logic elements, 1,400 Kbits of embedded memory, and 150 18x18 multipliers in a 256-pin FBGA package. The 5CEBA4F23C8N offers higher logic density, more memory, and more multipliers, while the 5CEBA2F17C7N provides a smaller package and lower resource count.
No. The 5CEBA4F23C8N uses a 484-pin FBGA package, while the 5CEBA2F17C7N uses a 256-pin FBGA package. The different pin counts and ball maps prevent direct pin-to-pin compatibility.
No. The two devices differ in package size, pin count, logic density, embedded memory, and multiplier count. A direct drop-in replacement is not possible without redesigning the PCB and verifying that the lower resource count of the 5CEBA2F17C7N meets the design requirements.
Both the 5CEBA4F23C8N and the 5CEBA2F17C7N are specified for commercial temperature operation, typically 0°C to 85°C junction temperature, as indicated by the "C" in the ordering code. Industrial and automotive temperature grades are available in other ordering options but are not applicable to these specific part numbers.
The 5CEBA2F17C7N generally consumes less power because it has fewer logic elements, less embedded memory, and fewer multipliers than the 5CEBA4F23C8N. However, actual power consumption depends on the specific design, clock frequencies, and I/O usage. Altera/Intel PowerPlay Early Power Estimator tools should be used for accurate comparison.
Yes. Both the 5CEBA4F23C8N and the 5CEBA2F17C7N are Cyclone V E FPGAs and support the same configuration schemes, including active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG configuration. Configuration details are documented in the Intel Cyclone V Device Handbook.
The 5CEBA4F23C8N is offered in a 484-pin FBGA package. The 5CEBA2F17C7N is offered in a 256-pin FBGA package. Both are lead-free and RoHS-compliant as standard Intel FPGA offerings.
The 5CEBA2F17C7N is better suited for space-constrained designs because its 256-pin FBGA package is significantly smaller than the 484-pin FBGA package of the 5CEBA4F23C8N. However, the designer must confirm that the lower logic and memory resources of the 5CEBA2F17C7N are sufficient for the application.