Part A
5CEBA7F23C7N
Intel
- Lifecycle
- Active
- Stock
- 4498 PCS
- Package
- FBGA-484
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Replacement verdict
Not a drop-in replacement
The 5CEBA7F23C7N and 5CEBA4U19C7N are not drop-in replacements for each other. Although both are Intel Cyclone V FPGAs sharing the same speed grade and core architecture, they differ fundamentally in logic density, package type, pin count, and I/O resources. The 5CEBA7F23C7N offers significantly higher logic capacity in a larger FBGA package, while the 5CEBA4U19C7N provides a more compact UBGA footprint with fewer resources. A direct substitution would require PCB redesign, re-pinout, and re-verification of timing closure and power delivery.
Different logic density
Different package type
Different pin count
Different I/O resources
Parts at a glance
Part B
5CEBA4U19C7N
Intel
- Lifecycle
- Active
- Stock
- 7845 PCS
- Package
- FBGA-484
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEBA7F23C7N | 5CEBA4U19C7N | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 150000 | 49000 | Logic element count determines the amount of programmable logic available for implementing custom digital functions; a large mismatch means the two devices are not functionally interchangeable for complex designs. |
| Total RAM Bits | 6865920 | 3036160 | Embedded memory capacity affects the ability to buffer data, implement FIFOs, and store coefficients; designs requiring large memory cannot be ported to the smaller device. |
| Number of I/Os | 240 | 224 | Available user I/O pins constrain how many external signals can be interfaced; a difference in pin count can prevent a direct board-level swap. |
| Package / Case | 484-FBGA (23x23) | 484-UBGA (19x19) | Package footprint and ball pitch must match the PCB land pattern; different package sizes or types make the parts physically non-substitutable without a board redesign. |
| Number of LABs/CLBs | 56480 | 18480 | Logic array blocks define the granularity of the programmable fabric; a lower count limits achievable design complexity and timing closure. |
| Operating Temperature Range | 0°C to 85°C (TJ) | 0°C to 85°C (TJ) | The junction temperature range must cover the application's thermal environment; identical ranges indicate both parts suit the same commercial temperature conditions. |
| Voltage - Supply | 1.07V to 1.13V | 1.07V to 1.13V | Core supply voltage must match the board's power delivery; identical rails allow the same power design to be reused. |
| Mounting Type | Surface Mount | Surface Mount | Mounting style determines assembly process compatibility; both being surface mount means the same reflow process can be used. |
| Series | Cyclone V E | Cyclone V E | Belonging to the same device family indicates shared architecture, IP, and toolchain support, which simplifies migration between the two parts. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEBA7F23C7N | 5CEBA4U19C7N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 56480 | 18480 |
| Number of Logic Elements/Cells | 149500 | 49000 |
| Total RAM Bits | 7880704 | 3464192 |
| Number of I/O | 240 | 224 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the 5CEBA7F23C7N and 5CEBA4U19C7N devices?
Both are Intel (formerly Altera) Cyclone V E series field-programmable gate arrays (FPGAs). The 5CEBA7F23C7N is a Cyclone V E FPGA with 150,000 logic elements (LEs) in a 484-pin FBGA package, while the 5CEBA4U19C7N is a Cyclone V E FPGA with 49,000 LEs in a 484-pin UBGA package. Both are specified with a C7 speed grade and are lead-free (N suffix).
How do the logic densities of the 5CEBA7F23C7N and 5CEBA4U19C7N compare?
The 5CEBA7F23C7N provides 150,000 logic elements (LEs), whereas the 5CEBA4U19C7N provides 49,000 LEs. The 5CEBA7F23C7N therefore offers approximately three times the logic capacity of the 5CEBA4U19C7N, making it suitable for larger, more complex designs.
Are the 5CEBA7F23C7N and 5CEBA4U19C7N pin-compatible?
No. The 5CEBA7F23C7N uses a 484-pin FBGA (FineLine BGA) package, while the 5CEBA4U19C7N uses a 484-pin UBGA (Ultra FineLine BGA) package. Although both have 484 pins, the package footprints, ball pitches, and PCB land patterns differ, so they are not drop-in replacements for each other.
Do the 5CEBA7F23C7N and 5CEBA4U19C7N have the same speed grade?
Yes. Both devices carry the C7 speed grade designation, indicating they are rated for the same core and I/O timing performance class within the Cyclone V E family. However, actual achievable performance depends on the specific design, resource utilization, and external conditions.
What memory resources are available in the 5CEBA7F23C7N versus the 5CEBA4U19C7N?
The 5CEBA7F23C7N includes 7,640 Kbits of embedded M10K memory, while the 5CEBA4U19C7N includes 3,080 Kbits of M10K memory. The 5CEBA7F23C7N also provides more embedded 18x18 multipliers (312 vs. 112) and more user I/O pins, reflecting its larger die and higher resource count.
Can the 5CEBA4U19C7N be used as a direct substitute for the 5CEBA7F23C7N in an existing design?
No. Direct substitution is not possible because the two devices differ in logic density, memory capacity, multiplier count, package type, and pinout. A design targeting the 5CEBA7F23C7N would require recompilation, re-pinout, and PCB redesign to migrate to the 5CEBA4U19C7N, and the smaller device may not fit the original design due to reduced resources.
What are the typical applications for the 5CEBA7F23C7N and 5CEBA4U19C7N?
Both devices are used in industrial, automotive, and communications applications. The 5CEBA7F23C7N, with its higher logic and memory resources, is suited for more complex functions such as image processing, protocol bridging, and motor control. The 5CEBA4U19C7N is typically used in cost-sensitive, lower-density applications such as sensor interfacing, simple control logic, and I/O expansion.
Are the 5CEBA7F23C7N and 5CEBA4U19C7N lead-free and RoHS compliant?
Yes. Both devices have the "N" suffix, which indicates lead-free (Pb-free) construction. Intel Cyclone V E devices with the N designation are RoHS-compliant and use lead-free solder balls and materials, as specified in the manufacturer's product documentation.