5CEBA7F23C7N vs 5CEBA7U19C7N

This in-depth comparison of the 5CEBA7F23C7N and 5CEBA7U19C7N provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Compatible functional replacement candidate

The 5CEBA7F23C7N and 5CEBA7U19C7N are both Intel Cyclone V FPGA devices sharing the same logic density, speed grade, and temperature grade, making them functionally comparable for many designs. However, they differ in package type and pin count, which affects PCB footprint and I/O availability. The 5CEBA7U19C7N offers a higher I/O count in a UBGA package, while the 5CEBA7F23C7N provides a larger FBGA package with a different ballout. Designers must validate pin compatibility and thermal performance before substituting one for the other.

Logic Density High match
Speed Grade High match
Package Type Validation required
I/O Count Validation required

Parts at a glance

Part A

5CEBA7F23C7N

Intel

Lifecycle
Active
Stock
4498 PCS
Package
FBGA-484
Series
Embedded - FPGAs (Field Programmable Gate Array)
Part B

5CEBA7U19C7N

Intel

Lifecycle
Active
Stock
9326 PCS
Package
FBGA-484
Series
Embedded - FPGAs (Field Programmable Gate Array)

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter 5CEBA7F23C7N 5CEBA7U19C7N Why it matters
Package / Case FBGA-484 UBGA-484 The package type determines the physical footprint, PCB land pattern, and thermal characteristics, so a different package prevents direct drop-in replacement.
Package Dimensions 23 x 23 mm 19 x 19 mm Different body sizes require different board layouts and may affect routing density and thermal management.
Ball Pitch 1.0 mm 0.8 mm Ball pitch dictates PCB manufacturing tolerances and escape routing capability; mismatched pitch makes the parts non-interchangeable on the same footprint.
Number of I/O Pins 224 240 Available user I/O affects how many peripherals and interfaces can be connected, influencing system design flexibility.
Number of LABs / Logic Elements 56480 LEs 56480 LEs Logic capacity determines the complexity of digital designs that can be implemented; identical capacity means equivalent logic resources.
Total RAM Bits 2867200 2867200 Embedded memory capacity affects buffering, FIFO depth, and data storage within the FPGA; identical values indicate equivalent on-chip memory.
Number of Transceivers 6 6 High-speed serial transceivers enable protocols like PCIe and Ethernet; equal counts mean similar high-speed interface capability.
Operating Temperature Range 0°C to 85°C (Commercial) 0°C to 85°C (Commercial) Temperature grade determines suitability for commercial versus industrial environments; identical ranges mean the same environmental applicability.
Supply Voltage - Core 1.1 V 1.1 V Core voltage must match the board power design; identical values allow the same power supply configuration.
Mounting Type Surface Mount Surface Mount Mounting style affects assembly process; both being surface mount means compatible reflow soldering processes.

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification 5CEBA7F23C7N 5CEBA7U19C7N
Supplier - Intel
Series Cyclone® V E Cyclone® V E
Part Status Active Active
Number of LABs/CLBs 56480 56480
Number of Logic Elements/Cells 149500 149500
Total RAM Bits 7880704 7880704
Number of I/O 240 240
Voltage - Supply 1.07V ~ 1.13V 1.07V ~ 1.13V
Mounting Type Surface Mount Surface Mount
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)

Frequently asked questions

What are the 5CEBA7F23C7N and 5CEBA7U19C7N devices?

Both are Intel (formerly Altera) Cyclone V E series field-programmable gate arrays (FPGAs). The 5CEBA7F23C7N is a 5CEBA7 device in a 484-pin FBGA package, while the 5CEBA7U19C7N is a 5CEBA7 device in a 484-pin UBGA package. Both are specified with a C7 speed grade and are lead-free (N suffix).

Do the 5CEBA7F23C7N and 5CEBA7U19C7N have the same logic density and resources?

Yes. Both devices are members of the same Cyclone V E A7 variant, so they share the same core fabric: approximately 149,500 logic elements (LEs), 9,560 kbits of embedded memory, and 156 variable-precision DSP blocks, as documented in the Intel Cyclone V Device Handbook.

What is the difference between the F23 and U19 package designators?

The F23 suffix indicates a 484-pin FineLine BGA (FBGA) package, while U19 indicates a 484-pin Ultra FineLine BGA (UBGA) package. Both packages have 484 balls, but they differ in physical dimensions, ball pitch, and PCB land pattern requirements, so they are not footprint-compatible.

Can the 5CEBA7F23C7N and 5CEBA7U19C7N be used interchangeably on the same PCB?

No. Although both are 484-ball packages, the FBGA (F23) and UBGA (U19) packages have different ball pitches, body sizes, and land patterns. A PCB designed for one package cannot directly accept the other without a layout redesign or an appropriate adapter.

Do both devices support the same transceiver and I/O capabilities?

Both are Cyclone V E A7 devices and share the same transceiver count and I/O bank architecture as defined by the device variant. However, the exact number of usable user I/Os can differ between the F23 and U19 packages due to different ball assignments and package routing. Designers should consult the Intel Cyclone V Pin Connection Guidelines and device pin-out files for the specific package.

Are the 5CEBA7F23C7N and 5CEBA7U19C7N both lead-free and RoHS compliant?

Yes. The "N" suffix in both part numbers indicates lead-free (Pb-free) construction, and both devices are RoHS compliant as stated in Intel's product material declarations for Cyclone V devices.

What is the operating temperature range for these devices?

The C7 speed grade in both part numbers corresponds to the commercial temperature range, typically 0°C to 85°C junction temperature (TJ), as specified in the Intel Cyclone V Device Datasheet. Industrial and automotive temperature grades use different speed grade suffixes.

Which configuration schemes are supported by both devices?

Both the 5CEBA7F23C7N and 5CEBA7U19C7N support the same Cyclone V configuration schemes, including active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG configuration, as documented in the Intel Cyclone V Device Handbook. Configuration scheme availability is a function of the device family, not the package.