Part A
5CEFA2F23C8N
Intel
- Lifecycle
- Active
- Stock
- 2565 PCS
- Package
- FBGA-484
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 5CEFA2F23C8N and 5CEFA2M13C8N are both Intel Cyclone V FPGAs sharing the same logic density, speed grade, and temperature grade, making them functionally interchangeable at the silicon level. However, they differ in package type and pin count, which affects PCB footprint and pinout compatibility. Designers must verify board-level mechanical and routing compatibility before substituting one for the other.
Logic Density
High match
Speed Grade
High match
Operating Temperature
High match
Package Type
Validation required
Parts at a glance
Part B
5CEFA2M13C8N
Intel
- Lifecycle
- Active
- Stock
- 4445 PCS
- Package
- TFBGA-383
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA2F23C8N | 5CEFA2M13C8N | Why it matters |
|---|---|---|---|
| Package / Case | FBGA-484 | MBGA-383 | Different package footprints and ball counts require different PCB layouts, so the two devices are not drop-in replacements for each other. |
| Number of I/Os | 224 | 112 | The available user I/O count determines how many external signals and peripherals the FPGA can interface with in a design. |
| Total RAM Bits | 1,224,576 | 1,224,576 | Embedded memory capacity affects the ability to buffer data and implement on-chip storage for DSP and control functions. |
| Number of Logic Elements / Cells | 25,000 | 25,000 | Logic element count defines the amount of programmable logic available for implementing custom digital functions. |
| Number of LABs / CLBs | 9,434 | 9,434 | Logic array block count influences routing resources and achievable logic density for a given design. |
| Operating Temperature Range | 0°C to 85°C (TJ) | 0°C to 85°C (TJ) | The temperature grade determines whether the device is suitable for commercial or harsher environmental conditions. |
| Voltage - Supply | 1.07V to 1.13V | 1.07V to 1.13V | Core supply voltage must match the board power design to ensure correct operation and signal integrity. |
| Mounting Type | Surface Mount | Surface Mount | Mounting style affects assembly processes and mechanical compatibility with the PCB. |
| Speed Grade | 8 | 8 | Speed grade indicates the maximum operating frequency and timing performance the device can reliably achieve. |
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Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA2F23C8N | 5CEFA2M13C8N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 9434 | 9434 |
| Number of Logic Elements/Cells | 25000 | 25000 |
| Total RAM Bits | 2002944 | 2002944 |
| Number of I/O | 224 | 223 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the key differences between the 5CEFA2F23C8N and the 5CEFA2M13C8N?
The primary differences are package type, pin count, and physical footprint. The 5CEFA2F23C8N uses a 484-pin FineLine BGA (FBGA) package, while the 5CEFA2M13C8N uses a 383-pin Micro FineLine BGA (MBGA) package. Both devices share the same Cyclone V E FPGA die, logic density, and speed grade (C8), but the different packages affect I/O count, PCB layout, and thermal characteristics.
Are the 5CEFA2F23C8N and 5CEFA2M13C8N functionally interchangeable?
No, they are not drop-in interchangeable. Although both are Cyclone V E FPGAs with equivalent core logic and speed grade, the different package footprints and pinouts require separate PCB designs. The 484-pin FBGA offers more user I/O than the 383-pin MBGA, so designs requiring higher I/O counts cannot use the smaller package without redesign.
Do both devices belong to the same FPGA family and logic density?
Yes. Both the 5CEFA2F23C8N and 5CEFA2M13C8N are Intel (formerly Altera) Cyclone V E series FPGAs with 25,000 logic elements (LEs). They share the same architecture, embedded memory blocks, DSP blocks, and transceiver capabilities as defined by the Cyclone V E device family.
What does the "C8" suffix indicate on both part numbers?
The "C8" suffix indicates the speed grade and operating temperature range. "C" denotes commercial temperature range (0°C to 85°C junction), and "8" denotes the fastest speed grade available for these devices. Both the 5CEFA2F23C8N and 5CEFA2M13C8N share this same speed and temperature rating.
Can the 5CEFA2M13C8N be used as a substitute for the 5CEFA2F23C8N in an existing design?
No, direct substitution is not possible without a PCB redesign. The 5CEFA2M13C8N has a 383-pin MBGA package with a different ball pitch and land pattern compared to the 484-pin FBGA of the 5CEFA2F23C8N. Additionally, the reduced pin count limits available I/O, power, and ground pins, which may not meet the original design requirements.
Which package offers better thermal performance for high-power applications?
The 5CEFA2F23C8N in the 484-pin FBGA package generally provides better thermal dissipation due to its larger body size and greater number of thermal balls. The 5CEFA2M13C8N in the 383-pin MBGA has a smaller footprint, which may limit heat spreading. Actual thermal performance depends on PCB design, airflow, and power consumption, and should be verified using Intel's thermal models.
Are configuration and programming methods the same for both devices?
Yes. Both the 5CEFA2F23C8N and 5CEFA2M13C8N support the same configuration schemes, including active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG. They use the same Intel Quartus Prime software and configuration files, provided the correct device and package are selected during compilation.
What are the typical applications for each package variant?
The 5CEFA2F23C8N (484-pin FBGA) is suited for designs requiring higher I/O counts, such as industrial control, video processing, and communication bridges. The 5CEFA2M13C8N (383-pin MBGA) is better for space-constrained applications where lower I/O count is acceptable, such as portable instrumentation, small form-factor embedded systems, and consumer electronics.