5CEFA4F23I7N
Intel
- Lifecycle
- Active
- Stock
- 6968 PCS
- Package
- FBGA-484
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
This in-depth comparison of the 5CEFA4F23I7N and 5CEFA2F23C7N provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.
Replacement verdict
The 5CEFA4F23I7N and 5CEFA2F23C7N are both Intel (Altera) Cyclone V F-series FPGAs in the same 484-pin FBGA package, sharing identical I/O count, transceiver count, and logic architecture. The 5CEFA4F23I7N offers approximately twice the logic density and embedded memory, making it a viable higher-capacity drop-in candidate for the 5CEFA2F23C7N in most designs, provided the application can accommodate the industrial temperature grade and the higher logic resource utilization does not affect power budgeting or timing closure.
Intel
Altera
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA4F23I7N | 5CEFA2F23C7N | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 44000 | 25000 | Logic capacity determines how much digital logic can be implemented; a smaller device may not fit the same design. |
| Total RAM Bits | 3080192 | 1956864 | On-chip memory affects buffering, FIFO depth, and whether a design fits without external memory. |
| Number of LABs/CLBs | 1650 | 943 | Logic array blocks indicate architectural granularity and available routing resources for placement. |
| Number of I/O | 224 | 224 | I/O count determines how many external signals can be interfaced directly with the device. |
| Operating Temperature Range | -40°C to 100°C (TJ) | 0°C to 85°C (TJ) | Industrial versus commercial temperature grades affect suitability for harsh or outdoor environments. |
| Speed Grade | 7 (Slowest) | 7 (Slowest) | Speed grade influences maximum clock frequency and timing closure for high-performance designs. |
| Package / Case | 484-FBGA (23x23) | 484-FBGA (23x23) | Package compatibility is essential for drop-in replacement on an existing PCB footprint. |
| Supply Voltage | 1.07V to 1.13V | 1.07V to 1.13V | Core voltage must match the board power design to avoid electrical damage or malfunction. |
| Mounting Type | Surface Mount | Surface Mount | Mounting style must match the assembly process and PCB land pattern. |
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Use manufacturer datasheets as the final authority.
| Specification | 5CEFA4F23I7N | 5CEFA2F23C7N |
|---|---|---|
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Digi Key Programmable | - | Not Verified |
| Total RAM Bits | 3464192 | 2002944 |
| Number of I/O | 224 | 224 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
| Base Product Number | - | 5CEFA2 |
| Number of Logic Elements / Cells | - | 25000 |
| Number of LA Bs / CL Bs | - | 9434 |
| Number of LABs/CLBs | 18480 | - |
| Number of Logic Elements/Cells | 49000 | - |
The 5CEFA4F23I7N and 5CEFA2F23C7N are both Intel (formerly Altera) Cyclone V FPGAs in the same 484-pin FBGA package (F23). The primary differences are logic density, speed grade, and operating temperature range. The 5CEFA4F23I7N offers approximately 49,000 logic elements (LEs) with a speed grade of 7 and an industrial temperature range (-40°C to 100°C junction). The 5CEFA2F23C7N offers approximately 25,000 LEs with a speed grade of 7 and a commercial temperature range (0°C to 85°C junction).
Yes, both devices are offered in the same 484-pin FBGA package (F23) and belong to the same Cyclone V E family. However, pin-to-pin compatibility does not guarantee functional equivalence. Designers must verify I/O bank assignments, transceiver availability, and power pin requirements against the respective device pin-out files before considering a swap.
No, a direct drop-in replacement is not recommended without design validation. The 5CEFA4F23I7N has higher logic density and an industrial temperature range, while the 5CEFA2F23C7N has lower logic density and a commercial temperature range. The target design must fit within the smaller device's resources, and the operating environment must not exceed the commercial temperature limits. Additionally, timing closure must be re-verified for the new device.
According to Intel Cyclone V device documentation, the 5CEFA4F23I7N contains approximately 49,000 logic elements (LEs), while the 5CEFA2F23C7N contains approximately 25,000 LEs. These values are based on the A4 and A2 density grades within the Cyclone V E family, respectively.
The 5CEFA4F23I7N is rated for the industrial temperature range, typically specified as -40°C to 100°C junction temperature (TJ). The 5CEFA2F23C7N is rated for the commercial temperature range, typically specified as 0°C to 85°C junction temperature (TJ). These ratings are indicated by the "I" and "C" suffixes in the part numbers, respectively.
Yes, both the 5CEFA4F23I7N and 5CEFA2F23C7N are Cyclone V FPGAs and support the same configuration schemes, including active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG configuration. Configuration details are documented in the Intel Cyclone V Device Handbook.
Both the 5CEFA4F23I7N and 5CEFA2F23C7N are speed grade 7 devices, as indicated by the "7" in their part numbers. Speed grade 7 is the fastest standard speed grade offered for the Cyclone V E family, though actual achievable performance depends on design-specific timing closure.
Both devices belong to the Cyclone V E family and share the same nominal power supply requirements, including VCC core voltage, VCCIO bank voltages, and VCCA PLL voltages. However, actual current consumption differs due to different logic densities and operating conditions. Designers should use the Intel Early Power Estimator (EPE) or PowerPlay Power Analyzer to calculate specific power requirements for each device in the target design.