5CEFA5U19I7N vs 5CEFA2U19A7N

This in-depth comparison of the 5CEFA5U19I7N and 5CEFA2U19A7N provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Compatible functional replacement candidate

The 5CEFA2U19A7N is a viable functional replacement candidate for the 5CEFA5U19I7N in applications where lower logic density and reduced on-chip memory are acceptable. Both devices share the same 484-pin UBGA package, Cyclone V FPGA family architecture, and core voltage requirements, enabling a direct board-level drop-in with no layout changes. However, the significant reduction in logic elements, adaptive logic modules, and embedded memory blocks must be validated against the target design's resource utilization before committing to the substitution.

Package Type High match
Core Voltage High match
Logic Density Validation required
Embedded Memory Validation required

Parts at a glance

Part A

5CEFA5U19I7N

Intel

Lifecycle
Active
Stock
1812 PCS
Package
UBGA-484
Series
Embedded - FPGAs (Field Programmable Gate Array)
Part B

5CEFA2U19A7N

Intel

Lifecycle
Active
Stock
2002 PCS
Package
FBGA-484
Series
Embedded - FPGAs (Field Programmable Gate Array)

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter 5CEFA5U19I7N 5CEFA2U19A7N Why it matters
Logic Elements (LE) 77,000 25,000 Logic element count determines the amount of programmable logic available for implementing custom digital functions; a large mismatch means the two devices are not functionally interchangeable for complex designs.
Total Embedded RAM 4,880 kbit 1,944 kbit On-chip memory capacity affects the ability to buffer data, implement FIFOs, and store lookup tables; designs relying on large memory blocks cannot be ported directly between these parts.
Embedded 18x18 Multipliers 150 75 Dedicated multiplier blocks are essential for DSP and arithmetic-intensive applications; fewer multipliers limits parallel signal processing capability.
Maximum User I/O Pins 224 224 Available I/O pins determine how many external signals the device can interface with; matching counts support similar board-level connectivity.
PLLs 6 4 Phase-locked loops generate and synchronize clock domains; fewer PLLs restricts the number of independent clock frequencies a design can support.
Package UBGA-484 UBGA-484 Package type and pin count must match for physical board compatibility; identical packages allow the same PCB footprint to be reused.
Operating Temperature Range -40°C to 100°C (Industrial) -40°C to 125°C (Automotive) Temperature grade affects reliability in harsh environments; automotive-grade parts support wider temperature extremes required in vehicle and industrial applications.
Speed Grade 7 (Fastest) 7 (Fastest) Speed grade determines maximum operating frequency and timing closure margins; matching grades ensures comparable performance characteristics.
Supply Voltage (Core) 1.1 V 1.1 V Core voltage must match the board power design; identical values allow the same power delivery network to be used.
Series Cyclone V E Cyclone V E Same device family ensures toolchain, IP, and configuration compatibility, simplifying migration between the two parts.

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification 5CEFA5U19I7N 5CEFA2U19A7N
Supplier - Intel
Series Cyclone® V E Cyclone® V E
Part Status Active Active
Number of LABs/CLBs 29080 9434
Number of Logic Elements/Cells 77000 25000
Total RAM Bits 5001216 2002944
Number of I/O 224 224
Voltage - Supply 1.07V ~ 1.13V 1.07V ~ 1.13V
Mounting Type Surface Mount Surface Mount
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 125°C (TJ)

Frequently asked questions

What are the key differences between the 5CEFA5U19I7N and the 5CEFA2U19A7N?

The 5CEFA5U19I7N and 5CEFA2U19A7N are both Intel (formerly Altera) Cyclone V FPGAs in the same 484-pin UBGA package (U19). The primary differences are logic density, speed grade, and operating temperature range. The 5CEFA5U19I7N offers approximately 77,000 logic elements (LEs) and is rated for industrial temperature range (I7, -40°C to 100°C junction). The 5CEFA2U19A7N offers approximately 25,000 LEs and is rated for automotive temperature range (A7, -40°C to 125°C junction).

Are the 5CEFA5U19I7N and 5CEFA2U19A7N pin-to-pin compatible?

Both devices are housed in the same 484-pin UBGA package (U19), which provides an identical physical footprint and ball map outline. However, pin-to-pin compatibility for a direct drop-in replacement requires verifying that all I/O bank assignments, transceiver channels, and dedicated pins are functionally equivalent for the target design. Intel documentation should be consulted to confirm that the specific pin functions used in the application are supported on both devices.

Can the 5CEFA2U19A7N be used as a direct substitute for the 5CEFA5U19I7N?

A direct substitution is not recommended without a full design review. The 5CEFA5U19I7N has significantly higher logic density (approximately 77,000 LEs) than the 5CEFA2U19A7N (approximately 25,000 LEs), so the design may not fit in the smaller device. Additionally, the speed grade and temperature grade differ (I7 industrial vs. A7 automotive), which affects timing closure and environmental qualification. Both the logic capacity and timing must be validated against the target application.

What are the operating temperature ranges for these two FPGAs?

The 5CEFA5U19I7N is specified for the industrial temperature grade (I7), which typically supports a junction temperature range of -40°C to 100°C. The 5CEFA2U19A7N is specified for the automotive temperature grade (A7), which typically supports a junction temperature range of -40°C to 125°C. These temperature grades are defined by Intel's Cyclone V device specifications and should be confirmed in the official datasheet for the exact ordering code.

Do both devices support the same transceiver and I/O standards?

Both the 5CEFA5U19I7N and 5CEFA2U19A7N belong to the Cyclone V F-series family and support a similar set of I/O standards and transceiver protocols, including LVDS, PCI Express, and Gigabit Ethernet, subject to device-specific resource availability. However, the number of transceiver channels and the maximum data rates may differ between the A2 and A5 density variants. Designers must verify the available transceiver count and supported protocols for each specific device in Intel's Cyclone V device handbook.

Which device is more suitable for automotive applications?

The 5CEFA2U19A7N is more suitable for automotive applications because its A7 suffix indicates an automotive temperature grade, typically rated for junction temperatures up to 125°C and qualified to automotive reliability standards. The 5CEFA5U19I7N carries an industrial temperature grade (I7) and is not specifically qualified for automotive use. Automotive system designers should select the A7-graded device when the application requires automotive qualification.

What package type do the 5CEFA5U19I7N and 5CEFA2U19A7N use?

Both devices use the U19 package designator, which corresponds to a 484-pin Ultra FineLine BGA (UBGA) package. This package is lead-free and RoHS-compliant, consistent with Intel's Cyclone V product family. The physical dimensions and ball pitch are identical between the two ordering codes because they share the same package code.

Are the configuration and power supply requirements the same for both devices?

Both devices are Cyclone V FPGAs and share the same family-level power supply architecture, including core voltage, I/O bank voltages, and transceiver power rails. However, the exact current consumption and decoupling requirements may differ due to the different logic densities and speed grades. Intel's power play early power estimator and the respective device datasheets should be used to confirm the specific power supply requirements for each ordering code.