Part A
5CEFA2M13C8N
Intel
- Lifecycle
- Active
- Stock
- 4445 PCS
- Package
- TFBGA-383
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Replacement verdict
Not a drop-in replacement
The 5CEFA9F23I7N and 5CEFA2M13C8N are not functionally interchangeable. They differ in logic density, package footprint, speed grade, and operating temperature range, so the 5CEFA2M13C8N cannot directly replace the 5CEFA9F23I7N in an existing design without significant redesign and revalidation.
Different logic density
Different package footprint
Different speed grade
Different temperature range
Parts at a glance
Part B
5CEFA9F23I7N
Intel
- Lifecycle
- Active
- Stock
- 4366 PCS
- Package
- BGA-484
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA9F23I7N | 5CEFA2M13C8N | Why it matters |
|---|---|---|---|
| Family | Cyclone V E | Cyclone V E | Same FPGA family ensures toolchain and IP compatibility. |
| Logic Elements (LEs) | 301,000 | 25,000 | LE count determines available logic capacity for the design. |
| Total RAM (Mbits) | 12,200 | 1,530 | Embedded memory affects buffering and data storage capability. |
| 18x18 Multipliers | 684 | 72 | DSP blocks impact arithmetic and signal processing throughput. |
| Package | FBGA-484 | MBGA-383 | Package type and pin count affect PCB layout and I/O availability. |
| Operating Temperature | -40°C to 100°C (Industrial) | 0°C to 85°C (Commercial) | Temperature grade determines suitability for harsh environments. |
| Speed Grade | 7 | 8 | Speed grade affects maximum operating frequency and timing closure. |
| Supply Voltage | 1.1 V | 1.1 V | Core voltage must match board power design for correct operation. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA2M13C8N | 5CEFA9F23I7N |
|---|---|---|
| Supplier | Intel | - |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 9434 | 113560 |
| Number of Logic Elements/Cells | 25000 | 301000 |
| Total RAM Bits | 2002944 | 14251008 |
| Number of I/O | 223 | 224 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
Frequently asked questions
What are the key differences between the 5CEFA9F23I7N and the 5CEFA2M13C8N?
The 5CEFA9F23I7N is a larger Cyclone V FPGA in the F23 package with 301,000 logic elements, 12,200 Kbits of embedded memory, and 480 18x18 multipliers, rated for industrial temperature range (I7). The 5CEFA2M13C8N is a smaller Cyclone V FPGA in the M13 package with 25,000 logic elements, 1,400 Kbits of embedded memory, and 72 18x18 multipliers, rated for commercial temperature range (C8). They differ in logic density, memory, DSP resources, package, and temperature grade.
Are the 5CEFA9F23I7N and 5CEFA2M13C8N pin-to-pin compatible?
No. The 5CEFA9F23I7N uses a 484-pin FBGA package (F23), while the 5CEFA2M13C8N uses a 383-pin Micro FBGA package (M13). The packages have different pin counts, footprints, and ball maps, so they are not pin-to-pin compatible.
Can the 5CEFA2M13C8N be used as a direct drop-in replacement for the 5CEFA9F23I7N?
No. The two devices differ in package, logic capacity, memory, DSP resources, and temperature grade. A direct drop-in replacement is not possible without redesigning the PCB, power delivery, and configuration circuitry, and revalidating the design against the target device's resources and timing.
What are the operating temperature ranges for the 5CEFA9F23I7N and 5CEFA2M13C8N?
The 5CEFA9F23I7N is specified for the industrial temperature grade (I7), typically -40°C to 100°C junction temperature. The 5CEFA2M13C8N is specified for the commercial temperature grade (C8), typically 0°C to 85°C junction temperature. The exact limits should be confirmed in the respective Intel Cyclone V device datasheet.
Do the 5CEFA9F23I7N and 5CEFA2M13C8N have the same FPGA family and architecture?
Yes. Both are Intel Cyclone V FPGAs and share the same Cyclone V architecture, including logic array blocks, M10K memory blocks, variable-precision DSP blocks, and transceiver options depending on the specific device variant. However, they differ in the amount of these resources and in package and speed grade.
Which device has more embedded memory and DSP resources?
The 5CEFA9F23I7N has significantly more embedded memory and DSP resources. It provides 12,200 Kbits of M10K memory and 480 18x18 multipliers. The 5CEFA2M13C8N provides 1,400 Kbits of M10K memory and 72 18x18 multipliers. These values are based on Intel Cyclone V device family specifications.
Are the configuration and power supply requirements the same for both devices?
No. Although both are Cyclone V FPGAs and share similar configuration schemes (e.g., active serial, passive serial, JTAG), the 5CEFA9F23I7N requires more power and has different rail current requirements due to its larger logic and memory resources. The 5CEFA2M13C8N has lower power demands. Power supply sequencing, decoupling, and configuration file sizes differ between the two devices and must be verified in the respective datasheets and pin-out files.
Can the same configuration bitstream be used for both the 5CEFA9F23I7N and 5CEFA2M13C8N?
No. The configuration bitstream is device-specific. The 5CEFA9F23I7N and 5CEFA2M13C8N have different logic capacities, memory sizes, and package pinouts, so a bitstream generated for one device cannot be used for the other. Each design must be compiled and fitted separately for the target device.