Part A
5CEFA9F27I7N
Intel
- Lifecycle
- Active
- Stock
- 7586 PCS
- Package
- BGA-672
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Replacement verdict
Not a drop-in replacement
The 5CEFA9F27I7N and 5CEFA2F23I7 are not functionally interchangeable. The 5CEFA9F27I7N offers substantially higher logic density, embedded memory, and multiplier resources in a larger 672-pin FineLine BGA package, while the 5CEFA2F23I7 provides a lower-density, lower-cost alternative in a 484-pin FineLine BGA package. A direct drop-in substitution is not feasible without a full redesign of the PCB footprint, power delivery network, and logic implementation.
Different logic density
Different package footprint
Different I/O count
Different memory resources
Parts at a glance
Part B
5CEFA2F23I7
Intel
- Lifecycle
- Active
- Stock
- 6309 PCS
- Package
- BGA-484
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA9F27I7N | 5CEFA2F23I7 | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 301,000 | 25,000 | Logic element count determines the maximum complexity of digital designs the FPGA can implement; a large difference means the two devices are not functionally substitutable for most designs. |
| Total RAM Bits | 13,917,200 | 1,944,000 | Embedded memory capacity limits on-chip buffering, FIFOs, and data storage; the larger device supports significantly more memory-intensive applications. |
| Number of 18x18 Multipliers | 684 | 72 | DSP multiplier blocks determine digital signal processing throughput; the difference affects suitability for arithmetic-heavy workloads. |
| Package / Pin Count | FBGA-672 | FBGA-484 | Package and pin count affect PCB footprint, routing, and available I/O; different packages are not drop-in compatible. |
| Maximum User I/O | 336 | 224 | User I/O count limits the number of external interfaces and peripherals that can be connected. |
| Supply Voltage (Core) | 1.1 V | 1.1 V | Core voltage must match the board power design; identical values simplify power supply reuse. |
| Operating Temperature Range | -40°C to 100°C (TJ) | -40°C to 100°C (TJ) | Industrial temperature rating ensures reliable operation in harsh environments; matching ratings allow use in the same thermal conditions. |
| Family / Series | Cyclone V E | Cyclone V E | Same family indicates compatible architecture and toolchain, but different density grades affect design migration. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA9F27I7N | 5CEFA2F23I7 |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 113560 | 9434 |
| Number of Logic Elements/Cells | 301000 | 25000 |
| Total RAM Bits | 14251008 | 2002944 |
| Number of I/O | 336 | 224 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) |
Frequently asked questions
What are the key differences between the 5CEFA9F27I7N and the 5CEFA2F23I7?
The 5CEFA9F27I7N and 5CEFA2F23I7 are both Intel (formerly Altera) Cyclone V F-series FPGAs, but they differ in logic density, package, and I/O count. The 5CEFA9F27I7N offers a significantly higher logic element count and more embedded resources than the 5CEFA2F23I7, making it suitable for more complex designs. The 5CEFA2F23I7 is a smaller device intended for lower-density applications.
Are the 5CEFA9F27I7N and 5CEFA2F23I7 pin-to-pin compatible?
No. The 5CEFA9F27I7N uses a 672-pin FBGA package (F27), while the 5CEFA2F23I7 uses a 484-pin FBGA package (F23). The different package sizes and pin counts mean they are not pin-to-pin compatible and cannot be interchanged on the same PCB footprint without redesign.
Can the 5CEFA2F23I7 be used as a direct drop-in replacement for the 5CEFA9F27I7N?
No. Beyond the package and pin count differences, the two devices have different logic capacities, memory resources, and I/O availability. A direct drop-in replacement is not possible; any substitution would require a full design review, recompilation, and PCB redesign.
What is the operating temperature range for both the 5CEFA9F27I7N and 5CEFA2F23I7?
Both devices are specified with the "I7" speed grade and industrial temperature range. Per Intel Cyclone V documentation, the industrial temperature range is typically –40°C to +100°C junction temperature (TJ). Designers should verify the exact thermal specifications in the official Intel Cyclone V datasheet for their specific use case.
Do both devices support the same configuration and transceiver options?
Both are Cyclone V F-series FPGAs and share the same family architecture, including support for configuration via active serial, passive serial, and JTAG. However, the number of transceiver channels and high-speed interfaces differs between the two due to their different densities and package options. The 5CEFA9F27I7N, with its larger package, provides more high-speed I/O and transceiver resources than the 5CEFA2F23I7.
Which device is more suitable for high-logic-density applications?
The 5CEFA9F27I7N is more suitable for high-logic-density applications. It belongs to the larger Cyclone V F-series variants and provides a higher number of logic elements, embedded memory blocks, and DSP blocks compared to the 5CEFA2F23I7. The 5CEFA2F23I7 is intended for lower-density, cost-sensitive designs.
Are the 5CEFA9F27I7N and 5CEFA2F23I7 lead-free and RoHS compliant?
Intel Cyclone V devices, including the 5CEFA9F27I7N and 5CEFA2F23I7, are generally available in lead-free, RoHS-compliant packages. The "N" suffix in the part numbers typically indicates lead-free/RoHS compliance. Designers should confirm the specific environmental compliance status through the official Intel product material declaration or distributor documentation for the exact ordering code.
Can I migrate a design from the 5CEFA2F23I7 to the 5CEFA9F27I7N without changing my HDL code?
HDL code may be portable between the two devices because they belong to the same Cyclone V family, but a simple recompilation is not sufficient. Pin assignments, timing constraints, PLL configuration, and I/O standards must be updated to match the different package and resource availability of the 5CEFA9F27I7N. A full re-fit and timing analysis in Intel Quartus Prime is required.