ADUC831BSZ
Analog Devices Inc.
- Lifecycle
- Active
- Stock
- 2439 PCS
- Package
- MQFP-52
- Series
- Embedded - Microcontrollers
This in-depth comparison of the ADUC831BSZ and ADUC845BS8-3 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.
Replacement verdict
The ADUC831BSZ and ADUC845BS8-3 are both MicroConverter 12-bit ADC MCUs from the same Analog Devices family, sharing core architecture and on-chip peripherals, but they differ in package, supply voltage, and memory configuration. The ADUC845BS8-3 is a viable functional candidate only after validating package footprint, supply rail, and flash/RAM requirements against the target design.
Analog Devices Inc.
Analog Devices Inc.
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | ADUC831BSZ | ADUC845BS8-3 | Why it matters |
|---|---|---|---|
| Core / CPU | 8051-compatible (single-cycle, 16 MHz max) | 8051-compatible (single-cycle, 12.58 MHz max) | Both are 8051 cores, but the maximum core clock differs, affecting instruction throughput and timing of peripherals. |
| Program Memory (Flash) | 62 kB | 62 kB | Flash size determines how much application code can be stored on-chip; identical here, so code size is not a differentiator. |
| Data Memory (SRAM) | 2 kB | 2.25 kB | On-chip SRAM affects available working memory for variables and stack; the slight difference may matter for memory-constrained firmware. |
| ADC Resolution / Channels | 12-bit, 8-channel (self-calibrating) | 24-bit, 8-channel (sigma-delta) | ADC architecture and resolution fundamentally determine measurement precision and are a primary reason to choose one part over the other. |
| DAC | Dual 12-bit voltage-output DAC | Dual 16-bit voltage-output DAC | DAC resolution affects analog output fidelity; the higher-resolution DAC on the ADUC845BS8-3 enables finer control in closed-loop applications. |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | Operating supply range must match the system rail; identical here, so power-supply design is compatible between the two. |
| Package | 48-lead LQFP | 52-lead MQFP | Package footprint and pin count affect PCB layout and cannot be swapped without a board redesign. |
| UART / Serial Interfaces | UART, SPI, I2C | UART, SPI, I2C | Serial interface availability determines connectivity options; identical here, so communication peripherals are interchangeable. |
| Operating Temperature Range | -40 °C to +85 °C | -40 °C to +85 °C | Temperature range defines environmental suitability; identical here, so both suit the same industrial-grade environments. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | ADUC831BSZ | ADUC845BS8-3 |
|---|---|---|
| Supplier | - | Rochester Electronics, LLC |
| Series | MicroConverter® ADuC8xx | MicroConverter® ADuC8xx |
| Part Status | Active | Obsolete |
| Core Processor | 8052 | 8052 |
| Core Size | 8-Bit | 8-Bit |
| Speed | 16MHz | 12.58MHz |
| Connectivity | EBI/EMI, I²C, SPI, UART/USART | I²C, SPI, UART/USART |
| Peripherals | PSM, Temp Sensor, WDT | POR, PSM, PWM, Temp Sensor, WDT |
| Number of I/O | 34 | 34 |
| Program Memory Size | 62KB (62K x 8) | 8KB (8K x 8) |
| Program Memory Type | FLASH | FLASH |
| EEPROM Size | 4K x 8 | 4K x 8 |
| RAM Size | 2.25K x 8 | 2.25K x 8 |
| Voltage - Supply (Vcc/Vdd) | 2.7V ~ 5.5V | 2.7V ~ 3.6V |
| Data Converters | A/D 8x12b; D/A 2x12b | A/D 10x24b; D/A 1x12b, 2x16b |
| Oscillator Type | Internal | Internal |
| Operating Temperature | -40°C ~ 125°C (TA) | -40°C ~ 125°C |
| Mounting Type | Surface Mount | Surface Mount |
The ADUC831BSZ is a MicroConverter 12-bit ADC with embedded 8-bit MCU in a 52-lead MQFP package, while the ADUC845BS8-3 is a MicroConverter dual 24-bit/16-bit sigma-delta ADC with embedded 8-bit MCU in an 80-lead LQFP package. The ADUC845BS8-3 offers higher resolution sigma-delta ADCs and more on-chip memory, whereas the ADUC831BSZ provides a faster 12-bit SAR ADC architecture.
No. The ADUC831BSZ uses a 52-lead MQFP package and the ADUC845BS8-3 uses an 80-lead LQFP package. The pin counts, package dimensions, and pin functions differ, so they are not drop-in replacements and require different PCB footprints.
The ADUC831BSZ integrates a 12-bit successive-approximation (SAR) ADC with up to 8 input channels. The ADUC845BS8-3 integrates dual sigma-delta ADCs: one 24-bit primary ADC and one 16-bit auxiliary ADC, suited for high-resolution low-frequency measurement applications.
The ADUC831BSZ provides 62 kBytes of on-chip flash/EE program memory and 2 kBytes of on-chip data RAM. The ADUC845BS8-3 provides 62 kBytes of on-chip flash/EE program memory and 2.25 kBytes of on-chip data RAM. Both include on-chip flash/EE data memory, but designers should confirm exact memory maps in the respective datasheets.
The ADUC831BSZ operates from a 3 V to 3.6 V supply. The ADUC845BS8-3 is specified for 3 V operation (the "-3" suffix denotes the 3 V version). Both are specified over the industrial temperature range of -40°C to +85°C. Verify exact limits in the manufacturer datasheets.
The ADUC845BS8-3 is generally better suited for high-resolution sensor measurement because its 24-bit sigma-delta primary ADC provides significantly higher resolution and lower noise for low-frequency signals. The ADUC831BSZ's 12-bit SAR ADC is better suited for faster, lower-resolution multi-channel sampling.
Both the ADUC831BSZ and ADUC845BS8-3 integrate a UART, an SPI interface, and an I2C-compatible interface as part of the MicroConverter serial peripheral set. Designers should confirm the exact peripheral configuration and pin multiplexing in the respective datasheets.
No, not as a direct substitute. The devices differ in package, pinout, ADC architecture, resolution, and memory. Substitution would require PCB redesign, firmware changes, and revalidation against the target application requirements.