ATXMEGA32D3-AU vs ATXMEGA384D3-AUR

This in-depth comparison of the ATXMEGA32D3-AU and ATXMEGA384D3-AUR provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

ISO9001 Quality Control ISO45001 ISO14001 100% Genuine
Part A

ATXMEGA32D3-AU

Microchip Technology

Lifecycle
Active
Stock
2403 PCS
Package
TQFP-64
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

ATXMEGA384D3-AUR

Microchip Technology

Lifecycle
Active
Stock
6680 PCS
Package
TQFP-64
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification ATXMEGA32D3-AU ATXMEGA384D3-AUR
Supplier - Microchip Technology
Series AVR® XMEGA® D3 AVR® XMEGA® D3
Part Status Active Active
Core Processor AVR AVR
Core Size 8/16-Bit 8/16-Bit
Speed 32MHz 32MHz
Connectivity I²C, IrDA, SPI, UART/USART I²C, IrDA, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, WDT Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O 50 50
Program Memory Size 32KB (16K x 16) 384KB (384K x 8)
Program Memory Type FLASH FLASH
EEPROM Size 1K x 8 4K x 8
RAM Size 4K x 8 32K x 8
Voltage - Supply (Vcc/Vdd) 1.6V ~ 3.6V 1.6V ~ 3.6V
Data Converters A/D 16x12b A/D 16x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
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