C8051F330 vs C8051F330-GP

This in-depth comparison of the C8051F330 and C8051F330-GP provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

C8051F330

Silicon Labs

Lifecycle
Active
Stock
4392 PCS
Package
VFQFN-20
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

C8051F330-GP

Silicon Labs

Lifecycle
Active
Stock
5433 PCS
Package
DIP-20
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification C8051F330 C8051F330-GP
Supplier - Silicon Labs
Series C8051F33x C8051F33x
Part Status Obsolete Obsolete
Core Processor 8051 8051
Core Size 8-Bit 8-Bit
Speed 25MHz 25MHz
Connectivity SMBus (2-Wire/I²C), SPI, UART/USART SMBus (2-Wire/I²C), SPI, UART/USART
Peripherals POR, PWM, Temp Sensor, WDT POR, PWM, Temp Sensor, WDT
Number of I/O 17 17
Program Memory Size 8KB (8K x 8) 8KB (8K x 8)
Program Memory Type FLASH FLASH
RAM Size 768 x 8 768 x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 3.6V 2.7V ~ 3.6V
Data Converters A/D 16x10b; D/A 1x10b A/D 16x10b; D/A 1x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Through Hole
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