DF3062BFI25QV vs DF3064BFBL25V

This in-depth comparison of the DF3062BFI25QV and DF3064BFBL25V provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

DF3062BFI25QV

Renesas Electronics America Inc

Lifecycle
Active
Stock
4885 PCS
Package
QFP-100
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

DF3064BFBL25V

Renesas Electronics America Inc

Lifecycle
Active
Stock
8661 PCS
Package
BFQFP-100
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification DF3062BFI25QV DF3064BFBL25V
Supplier - Renesas Electronics America Inc
Series H8® H8/300H H8® H8/300H
Part Status Not For New Designs Active
Core Processor H8/300H H8/300H
Core Size 16-Bit 16-Bit
Speed 25MHz 25MHz
Connectivity SCI, SmartCard SCI, SmartCard
Peripherals DMA, POR, PWM, WDT PWM, WDT
Number of I/O 70 70
Program Memory Size 128KB (128K x 8) 256KB (256K x 8)
Program Memory Type FLASH FLASH
RAM Size 4K x 8 8K x 8
Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V 4.5V ~ 5.5V
Data Converters A/D 8x10b; D/A 2x8b A/D 8x10b; D/A 2x8b
Oscillator Type Internal Internal
Operating Temperature -20°C ~ 75°C (TA) -20°C ~ 75°C (TA)
Mounting Type Surface Mount Surface Mount
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