DSP56303AG100 vs DSP56301PW100

This in-depth comparison of the DSP56303AG100 and DSP56301PW100 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

ISO9001 Quality Control ISO45001 ISO14001 100% Genuine
Part A

DSP56303AG100

NXP USA Inc.

Lifecycle
Active
Stock
2147 PCS
Package
LQFP-144
Series
Embedded - DSP (Digital Signal Processors)
+BOM RFQ
Part B

DSP56301PW100

NXP USA Inc.

Lifecycle
Active
Stock
3628 PCS
Package
LQFP-208
Series
Embedded - DSP (Digital Signal Processors)
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification DSP56303AG100 DSP56301PW100
Supplier - NXP USA Inc.
Series DSP563xx DSP563xx
Part Status Obsolete Obsolete
Type Fixed Point Fixed Point
Interface Host Interface, SSI, SCI Host Interface, SSI, SCI
Clock Rate 100MHz 100MHz
Non - Volatile Memory ROM (576B) ROM (9kB)
On - Chip RAM 24kB 24kB
Voltage - I / O 3.30V 3.30V
Voltage - Core 3.30V 3.30V
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ)
Mounting Type Surface Mount Surface Mount
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