DSP56321VF275 vs DSP56303VF100

This in-depth comparison of the DSP56321VF275 and DSP56303VF100 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

ISO9001 Quality Control ISO45001 ISO14001 100% Genuine
Part A

DSP56321VF275

NXP USA Inc.

Lifecycle
Active
Stock
8786 PCS
Package
BGA-196
Series
Embedded - DSP (Digital Signal Processors)
+BOM RFQ
Part B

DSP56303VF100

NXP USA Inc.

Lifecycle
Active
Stock
8875 PCS
Package
LBGA-196
Series
Embedded - DSP (Digital Signal Processors)
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification DSP56321VF275 DSP56303VF100
Supplier Rochester Electronics, LLC,NXP USA Inc. NXP USA Inc.
Series DSP56K/Symphony DSP563xx
Part Status Last Time Buy Obsolete
Type Fixed Point Fixed Point
Interface Host Interface, SSI, SCI Host Interface, SSI, SCI
Clock Rate 275MHz 100MHz
Non - Volatile Memory ROM (576B) ROM (576B)
On - Chip RAM 576kB 24kB
Voltage - I / O 3.30V 3.30V
Voltage - Core 1.60V 3.30V
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ)
Mounting Type Surface Mount Surface Mount
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