DSP56F805FV80E vs DSP56303AG100B1

This in-depth comparison of the DSP56F805FV80E and DSP56303AG100B1 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

DSP56F805FV80E

NXP USA Inc.

Lifecycle
Active
Stock
3106 PCS
Package
LQFP-144
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

DSP56303AG100B1

NXP USA Inc.

Lifecycle
Active
Stock
4317 PCS
Package
LQFP-144
Series
Embedded - DSP (Digital Signal Processors)
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification DSP56F805FV80E DSP56303AG100B1
Supplier - NXP USA Inc.
Series 56F8xx DSP563xx
Part Status Active Obsolete
Type - Fixed Point
Interface - Host Interface, SSI, SCI
Clock Rate - 100MHz
Non - Volatile Memory - ROM (576B)
On - Chip RAM - 24kB
Voltage - I / O - 3.30V
Voltage - Core - 3.30V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 100°C (TJ)
Mounting Type Surface Mount Surface Mount
Core Processor 56800 -
Core Size 16-Bit -
Speed 80MHz -
Connectivity CANbus, EBI/EMI, SCI, SPI -
Peripherals POR, PWM, WDT -
Number of I/O 32 -
Program Memory Size 64KB (32K x 16) -
Program Memory Type FLASH -
RAM Size 2K x 16 -
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V -
Data Converters A/D 8x12b -
Oscillator Type External -
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