DSP56F807PY80E vs DSP56301AG100

This in-depth comparison of the DSP56F807PY80E and DSP56301AG100 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

DSP56F807PY80E

NXP USA Inc.

Lifecycle: Active
Stock: 2862 PCS
Package: LQFP-160
Series: Embedded - Microcontrollers

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Part B

DSP56301AG100

NXP USA Inc.

Lifecycle: Active
Stock: 4791 PCS
Package: LQFP-208
Series: Embedded - DSP (Digital Signal Processors)

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	DSP56F807PY80E	DSP56301AG100
Supplier	-	NXP USA Inc.
Series	56F8xx	DSP563xx
Part Status	Active	Obsolete
Type	-	Fixed Point
Interface	-	Host Interface, SSI, SCI
Clock Rate	-	100MHz
Non - Volatile Memory	-	ROM (9kB)
On - Chip RAM	-	24kB
Voltage - I / O	-	3.30V
Voltage - Core	-	3.30V
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 100°C (TJ)
Mounting Type	Surface Mount	Surface Mount
Core Processor	56800	-
Core Size	16-Bit	-
Speed	80MHz	-
Connectivity	CANbus, EBI/EMI, SCI, SPI	-
Peripherals	POR, PWM, WDT	-
Number of I/O	32	-
Program Memory Size	120KB (60K x 16)	-
Program Memory Type	FLASH	-
RAM Size	4K x 16	-
Voltage - Supply (Vcc/Vdd)	3V ~ 3.6V	-
Data Converters	A/D 16x12b	-
Oscillator Type	External	-

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