DSPB56720AG vs DSPB56721AF

This in-depth comparison of the DSPB56720AG and DSPB56721AF provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

DSPB56720AG

NXP USA Inc.

Lifecycle
Active
Stock
7476 PCS
Package
LQFP-144
Series
Embedded - DSP (Digital Signal Processors)
+BOM RFQ
Part B

DSPB56721AF

NXP USA Inc.

Lifecycle
Active
Stock
3331 PCS
Package
QFP-80
Series
Embedded - DSP (Digital Signal Processors)
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification DSPB56720AG DSPB56721AF
Supplier - NXP USA Inc.
Series DSP56K/Symphony DSP56K/Symphony
Part Status Not For New Designs Not For New Designs
Type Audio Processor Audio Processor
Interface Host Interface, I²C, SAI, SPI Host Interface, I²C, SAI, SPI
Clock Rate 200MHz 200MHz
Non - Volatile Memory External External
On - Chip RAM 744kB 744kB
Voltage - I / O 3.30V 3.30V
Voltage - Core 1.00V 1.00V
Operating Temperature 0°C ~ 70°C (TA) 0°C ~ 70°C (TA)
Mounting Type Surface Mount Surface Mount
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