EP1C20F324C8N vs EP1C20F324C8

This in-depth comparison of the EP1C20F324C8N and EP1C20F324C8 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

EP1C20F324C8N

Intel

Lifecycle: Active
Stock: 1833 PCS
Package: FBGA-324
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

Part B

EP1C20F324C8

Intel

Lifecycle: Active
Stock: 4694 PCS
Package: BGA-324
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

Need help validating a replacement?

Send your BOM and application constraints for technical and sourcing review.

RFQ Contact technical support

Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	EP1C20F324C8N	EP1C20F324C8
Supplier	-	Intel
Series	Cyclone®	Cyclone®
Part Status	Obsolete	Obsolete
Number of LABs/CLBs	2006	2006
Number of Logic Elements/Cells	20060	20060
Total RAM Bits	294912	294912
Number of I/O	233	233
Voltage - Supply	1.425V ~ 1.575V	1.425V ~ 1.575V
Mounting Type	Surface Mount	Surface Mount
Operating Temperature	0°C ~ 85°C (TJ)	0°C ~ 85°C (TJ)

Compare RFQ