EP1C3T100C8N vs EP1C3T100C8

This in-depth comparison of the EP1C3T100C8N and EP1C3T100C8 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

EP1C3T100C8N

Intel

Lifecycle: Active
Stock: 2223 PCS
Package: TQFP-100
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

Part B

EP1C3T100C8

Intel

Lifecycle: Active
Stock: 5578 PCS
Package: TQFP-100
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	EP1C3T100C8N	EP1C3T100C8
Supplier	-	Intel
Series	Cyclone®	Cyclone®
Part Status	Obsolete	Obsolete
Number of LABs/CLBs	291	291
Number of Logic Elements/Cells	2910	2910
Total RAM Bits	59904	59904
Number of I/O	65	65
Voltage - Supply	1.425V ~ 1.575V	1.425V ~ 1.575V
Mounting Type	Surface Mount	Surface Mount
Operating Temperature	0°C ~ 85°C (TJ)	0°C ~ 85°C (TJ)

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