EP1C4F400C8N vs EP1C4F324C6

This in-depth comparison of the EP1C4F400C8N and EP1C4F324C6 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

EP1C4F400C8N

Intel

Lifecycle: Active
Stock: 3691 PCS
Package: BGA-400
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

Part B

EP1C4F324C6

Intel

Lifecycle: Active
Stock: 8060 PCS
Package: BGA-324
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	EP1C4F400C8N	EP1C4F324C6
Supplier	-	Intel
Series	Cyclone®	Cyclone®
Part Status	Obsolete	Obsolete
Number of LABs/CLBs	400	400
Number of Logic Elements/Cells	4000	4000
Total RAM Bits	78336	78336
Number of I/O	301	249
Voltage - Supply	1.425V ~ 1.575V	1.425V ~ 1.575V
Mounting Type	Surface Mount	Surface Mount
Operating Temperature	0°C ~ 85°C (TJ)	0°C ~ 85°C (TJ)

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