EP2C20F256I8N vs EP2C20F256C8

This in-depth comparison of the EP2C20F256I8N and EP2C20F256C8 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

EP2C20F256I8N

Intel

Lifecycle: Active
Stock: 7622 PCS
Package: FBGA-256
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

Part B

EP2C20F256C8

Intel

Lifecycle: Active
Stock: 5901 PCS
Package: LBGA-256
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	EP2C20F256I8N	EP2C20F256C8
Supplier	-	Intel
Series	Cyclone® II	Cyclone® II
Part Status	Active	Active
Number of LABs/CLBs	1172	1172
Number of Logic Elements/Cells	18752	18752
Total RAM Bits	239616	239616
Number of I/O	152	152
Voltage - Supply	1.15V ~ 1.25V	1.15V ~ 1.25V
Mounting Type	Surface Mount	Surface Mount
Operating Temperature	-40°C ~ 100°C (TJ)	0°C ~ 85°C (TJ)

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