EP2C35F672C8N vs EP2C35F484I8N

This in-depth comparison of the EP2C35F672C8N and EP2C35F484I8N provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

EP2C35F672C8N

Intel

Lifecycle: Active
Stock: 2719 PCS
Package: FBGA-672
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

Part B

EP2C35F484I8N

Intel

Lifecycle: Active
Stock: 3647 PCS
Package: FBGA-484
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

Need help validating a replacement?

Send your BOM and application constraints for technical and sourcing review.

RFQ Contact technical support

Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	EP2C35F672C8N	EP2C35F484I8N
Series	Cyclone® II	Cyclone® II
Part Status	Active	Active
Number of LABs/CLBs	2076	2076
Number of Logic Elements/Cells	33216	33216
Total RAM Bits	483840	483840
Number of I/O	475	322
Voltage - Supply	1.15V ~ 1.25V	1.15V ~ 1.25V
Mounting Type	Surface Mount	Surface Mount
Operating Temperature	0°C ~ 85°C (TJ)	-40°C ~ 100°C (TJ)

Compare RFQ