EP2C70F672I8N vs EP2C70F896C8N

This in-depth comparison of the EP2C70F672I8N and EP2C70F896C8N provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

EP2C70F672I8N

Intel

Lifecycle: Active
Stock: 5034 PCS
Package: BGA-672
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

Part B

EP2C70F896C8N

Intel

Lifecycle: Active
Stock: 7177 PCS
Package: BGA-896
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	EP2C70F672I8N	EP2C70F896C8N
Supplier	-	Intel
Series	Cyclone® II	Cyclone® II
Part Status	Active	Active
Number of LABs/CLBs	4276	4276
Number of Logic Elements/Cells	68416	68416
Total RAM Bits	1152000	1152000
Number of I/O	422	622
Voltage - Supply	1.15V ~ 1.25V	1.15V ~ 1.25V
Mounting Type	Surface Mount	Surface Mount
Operating Temperature	-40°C ~ 100°C (TJ)	0°C ~ 85°C (TJ)

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