EP3C10F256C8N vs EP3C16F484C6

This in-depth comparison of the EP3C10F256C8N and EP3C16F484C6 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

EP3C10F256C8N

Intel

Lifecycle: Active
Stock: 5779 PCS
Package: FBGA-256
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

Part B

EP3C16F484C6

Intel

Lifecycle: Active
Stock: 2263 PCS
Package: BGA-484
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	EP3C10F256C8N	EP3C16F484C6
Supplier	-	Intel
Series	Cyclone® III	Cyclone® III
Part Status	Active	Active
Number of LABs/CLBs	645	963
Number of Logic Elements/Cells	10320	15408
Total RAM Bits	423936	516096
Number of I/O	182	346
Voltage - Supply	1.15V ~ 1.25V	1.15V ~ 1.25V
Mounting Type	Surface Mount	Surface Mount
Operating Temperature	0°C ~ 85°C (TJ)	0°C ~ 85°C (TJ)

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