EP3C25F324C8N vs EP3C25F256C6

This in-depth comparison of the EP3C25F324C8N and EP3C25F256C6 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

EP3C25F324C8N

Intel

Lifecycle: Active
Stock: 5266 PCS
Package: FBGA-324
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

Part B

EP3C25F256C6

Intel

Lifecycle: Active
Stock: 9279 PCS
Package: LBGA-256
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	EP3C25F324C8N	EP3C25F256C6
Supplier	-	Intel
Series	Cyclone® III	Cyclone® III
Part Status	Active	Active
Number of LABs/CLBs	1539	1539
Number of Logic Elements/Cells	24624	24624
Total RAM Bits	608256	608256
Number of I/O	215	156
Voltage - Supply	1.15V ~ 1.25V	1.15V ~ 1.25V
Mounting Type	Surface Mount	Surface Mount
Operating Temperature	0°C ~ 85°C (TJ)	0°C ~ 85°C (TJ)

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