EP3C40F324I7N vs EP3C40F780C8

This in-depth comparison of the EP3C40F324I7N and EP3C40F780C8 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

EP3C40F324I7N

Intel

Lifecycle: Active
Stock: 5632 PCS
Package: FBGA-324
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

Part B

EP3C40F780C8

Intel

Lifecycle: Active
Stock: 7699 PCS
Package: BGA-780
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	EP3C40F324I7N	EP3C40F780C8
Supplier	-	Intel
Series	Cyclone® III	Cyclone® III
Part Status	Active	Active
Number of LABs/CLBs	2475	2475
Number of Logic Elements/Cells	39600	39600
Total RAM Bits	1161216	1161216
Number of I/O	195	535
Voltage - Supply	1.15V ~ 1.25V	1.15V ~ 1.25V
Mounting Type	Surface Mount	Surface Mount
Operating Temperature	-40°C ~ 100°C (TJ)	0°C ~ 85°C (TJ)

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