EP3C40F780C8N vs EP3C40F324C7N

This in-depth comparison of the EP3C40F780C8N and EP3C40F324C7N provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

EP3C40F780C8N

Intel

Lifecycle
Active
Stock
3550 PCS
Package
FBGA-780
Series
Embedded - FPGAs (Field Programmable Gate Array)
+BOM RFQ
Part B

EP3C40F324C7N

Intel

Lifecycle
Active
Stock
5050 PCS
Package
BGA-324
Series
Embedded - FPGAs (Field Programmable Gate Array)
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification EP3C40F780C8N EP3C40F324C7N
Supplier - Intel
Series Cyclone® III Cyclone® III
Part Status Active Active
Number of LABs/CLBs 2475 2475
Number of Logic Elements/Cells 39600 39600
Total RAM Bits 1161216 1161216
Number of I/O 535 195
Voltage - Supply 1.15V ~ 1.25V 1.15V ~ 1.25V
Mounting Type Surface Mount Surface Mount
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Compare RFQ