EP3C55F484C8N vs EP3C55F780C8

This in-depth comparison of the EP3C55F484C8N and EP3C55F780C8 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
EP3C55F484C8N

+BOM

4267 PCS | Intel
EP3C55F780C8

+BOM

5170 PCS | Intel
Package FBGA-484 BGA-780
Description IC FPGA 327 I/O 484FBGA IC FPGA 377 I/O 780FBGA
Supplier - Intel
Series Cyclone® III Cyclone® III
ProductStatus Active Active
NumberofLABs/CLBs 3491 3491
NumberofLogicElements/Cells 55856 55856
TotalRAMBits 2396160 2396160
NumberofI/O 327 377
Voltage-Supply 1.15V ~ 1.25V 1.15V ~ 1.25V
MountingType Surface Mount Surface Mount
OperatingTemperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Comparison Model : EP3C55F484C8N EP3C55F780C8

+BOM RFQ