EP3C55F780C7N vs EP3C55F780C8N

This in-depth comparison of the EP3C55F780C7N and EP3C55F780C8N provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

EP3C55F780C7N

Intel

Lifecycle
Active
Stock
4875 PCS
Package
FBGA-780
Series
Embedded - FPGAs (Field Programmable Gate Array)
+BOM RFQ
Part B

EP3C55F780C8N

Intel

Lifecycle
Active
Stock
7285 PCS
Package
BGA-780
Series
Embedded - FPGAs (Field Programmable Gate Array)
+BOM RFQ

Need help validating a replacement?

Send your BOM and application constraints for technical and sourcing review.

RFQ Contact technical support

Full specification comparison

Use manufacturer datasheets as the final authority.

Specification EP3C55F780C7N EP3C55F780C8N
Supplier - Intel
Series Cyclone® III Cyclone® III
Part Status Active Active
Number of LABs/CLBs 3491 3491
Number of Logic Elements/Cells 55856 55856
Total RAM Bits 2396160 2396160
Number of I/O 377 377
Voltage - Supply 1.15V ~ 1.25V 1.15V ~ 1.25V
Mounting Type Surface Mount Surface Mount
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Compare RFQ