EP3SL110F1152C4N vs EP3SL50F780C3

This in-depth comparison of the EP3SL110F1152C4N and EP3SL50F780C3 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

EP3SL110F1152C4N

Intel

Lifecycle: Active
Stock: 5130 PCS
Package: BBGA-1152
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

Part B

EP3SL50F780C3

Intel

Lifecycle: Active
Stock: 4370 PCS
Package: BBGA-780
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	EP3SL110F1152C4N	EP3SL50F780C3
Supplier	-	Intel
Series	Stratix® III L	Stratix® III L
Part Status	Obsolete	Obsolete
Number of LABs/CLBs	4300	1900
Number of Logic Elements/Cells	107500	47500
Total RAM Bits	4992000	2184192
Number of I/O	744	488
Voltage - Supply	0.86V ~ 1.15V	0.86V ~ 1.15V
Mounting Type	Surface Mount	Surface Mount
Operating Temperature	0°C ~ 85°C (TJ)	0°C ~ 85°C (TJ)

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