EP3SL50F484C3N vs EP3SL110F1152C2

This in-depth comparison of the EP3SL50F484C3N and EP3SL110F1152C2 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

EP3SL50F484C3N

Intel

Lifecycle: Active
Stock: 7410 PCS
Package: FBGA-484
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

Part B

EP3SL110F1152C2

Intel

Lifecycle: Active
Stock: 3003 PCS
Package: BBGA-1152
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	EP3SL50F484C3N	EP3SL110F1152C2
Supplier	-	Intel
Series	Stratix® III L	Stratix® III L
Part Status	Obsolete	Obsolete
Number of LABs/CLBs	1900	4300
Number of Logic Elements/Cells	47500	107500
Total RAM Bits	2184192	4992000
Number of I/O	296	744
Voltage - Supply	0.86V ~ 1.15V	0.86V ~ 1.15V
Mounting Type	Surface Mount	Surface Mount
Operating Temperature	0°C ~ 85°C (TJ)	0°C ~ 85°C (TJ)

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