EP4CE10F17C8N vs EP4CE10F17C8

This in-depth comparison of the EP4CE10F17C8N and EP4CE10F17C8 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

EP4CE10F17C8N

Intel

Lifecycle: Active
Stock: 3019 PCS
Package: FBGA-256
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

Part B

EP4CE10F17C8

Intel

Lifecycle: Active
Stock: 8322 PCS
Package: LBGA-256
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	EP4CE10F17C8N	EP4CE10F17C8
Supplier	-	Intel
Series	Cyclone® IV E	Cyclone® IV E
Part Status	Active	Active
Number of LABs/CLBs	645	645
Number of Logic Elements/Cells	10320	10320
Total RAM Bits	423936	423936
Number of I/O	179	179
Voltage - Supply	1.15V ~ 1.25V	1.15V ~ 1.25V
Mounting Type	Surface Mount	Surface Mount
Operating Temperature	0°C ~ 85°C (TJ)	0°C ~ 85°C (TJ)

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