EP4CE22F17I7N vs EP4CE40F29C8

This in-depth comparison of the EP4CE22F17I7N and EP4CE40F29C8 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

EP4CE22F17I7N

Intel

Lifecycle: Active
Stock: 2208 PCS
Package: FBGA-256
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

Part B

EP4CE40F29C8

Intel

Lifecycle: Active
Stock: 2028 PCS
Package: BGA-780
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	EP4CE22F17I7N	EP4CE40F29C8
Supplier	-	Intel
Series	Cyclone® IV E	Cyclone® IV E
Part Status	Active	Active
Number of LABs/CLBs	1395	2475
Number of Logic Elements/Cells	22320	39600
Total RAM Bits	608256	1161216
Number of I/O	153	532
Voltage - Supply	1.15V ~ 1.25V	1.15V ~ 1.25V
Mounting Type	Surface Mount	Surface Mount
Operating Temperature	-40°C ~ 100°C (TJ)	0°C ~ 85°C (TJ)

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