EP4CE30F23I7N vs EP4CE40F23C8

This in-depth comparison of the EP4CE30F23I7N and EP4CE40F23C8 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

EP4CE30F23I7N

Intel

Lifecycle: Active
Stock: 2627 PCS
Package: FBGA-484
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

Part B

EP4CE40F23C8

Intel

Lifecycle: Active
Stock: 6824 PCS
Package: BGA-484
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	EP4CE30F23I7N	EP4CE40F23C8
Supplier	-	Intel
Series	Cyclone® IV E	Cyclone® IV E
Part Status	Active	Active
Number of LABs/CLBs	1803	2475
Number of Logic Elements/Cells	28848	39600
Total RAM Bits	608256	1161216
Number of I/O	328	328
Voltage - Supply	1.15V ~ 1.25V	1.15V ~ 1.25V
Mounting Type	Surface Mount	Surface Mount
Operating Temperature	-40°C ~ 100°C (TJ)	0°C ~ 85°C (TJ)

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