EP4CE30F29C8N vs EP4CE22F17I7

This in-depth comparison of the EP4CE30F29C8N and EP4CE22F17I7 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

EP4CE30F29C8N

Intel

Lifecycle: Active
Stock: 1755 PCS
Package: FBGA-780
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

Part B

EP4CE22F17I7

Intel

Lifecycle: Active
Stock: 3056 PCS
Package: LBGA-256
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	EP4CE30F29C8N	EP4CE22F17I7
Supplier	-	Intel
Series	Cyclone® IV E	Cyclone® IV E
Part Status	Active	Active
Number of LABs/CLBs	1803	1395
Number of Logic Elements/Cells	28848	22320
Total RAM Bits	608256	608256
Number of I/O	532	153
Voltage - Supply	1.15V ~ 1.25V	1.15V ~ 1.25V
Mounting Type	Surface Mount	Surface Mount
Operating Temperature	0°C ~ 85°C (TJ)	-40°C ~ 100°C (TJ)

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