EP4CE55F23C6N vs EP4CE115F23C7

This in-depth comparison of the EP4CE55F23C6N and EP4CE115F23C7 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

EP4CE55F23C6N

Intel

Lifecycle: Active
Stock: 4944 PCS
Package: FBGA-484
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

Part B

EP4CE115F23C7

Intel

Lifecycle: Active
Stock: 5199 PCS
Package: BGA-484
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	EP4CE55F23C6N	EP4CE115F23C7
Supplier	-	Intel
Series	Cyclone® IV E	Cyclone® IV E
Part Status	Active	Active
Number of LABs/CLBs	3491	7155
Number of Logic Elements/Cells	55856	114480
Total RAM Bits	2396160	3981312
Number of I/O	324	280
Voltage - Supply	1.15V ~ 1.25V	1.15V ~ 1.25V
Mounting Type	Surface Mount	Surface Mount
Operating Temperature	0°C ~ 85°C (TJ)	0°C ~ 85°C (TJ)

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