EP4CE6F17C6N vs EP4CE15F23C7

This in-depth comparison of the EP4CE6F17C6N and EP4CE15F23C7 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

EP4CE6F17C6N

Intel

Lifecycle: Active
Stock: 4781 PCS
Package: FBGA-256
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

Part B

EP4CE15F23C7

Intel

Lifecycle: Active
Stock: 6660 PCS
Package: BGA-484
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	EP4CE6F17C6N	EP4CE15F23C7
Supplier	-	Intel
Series	Cyclone® IV E	Cyclone® IV E
Part Status	Active	Active
Number of LABs/CLBs	392	963
Number of Logic Elements/Cells	6272	15408
Total RAM Bits	276480	516096
Number of I/O	179	343
Voltage - Supply	1.15V ~ 1.25V	1.15V ~ 1.25V
Mounting Type	Surface Mount	Surface Mount
Operating Temperature	0°C ~ 85°C (TJ)	0°C ~ 85°C (TJ)

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