EP4CE6F17C6N vs EP4CE22F17I8L

This in-depth comparison of the EP4CE6F17C6N and EP4CE22F17I8L provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

EP4CE6F17C6N

Intel

Lifecycle: Active
Stock: 4781 PCS
Package: FBGA-256
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

Part B

EP4CE22F17I8L

Intel

Lifecycle: Active
Stock: 6179 PCS
Package: LBGA-256
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	EP4CE6F17C6N	EP4CE22F17I8L
Supplier	-	Intel
Series	Cyclone® IV E	Cyclone® IV E
Part Status	Active	Active
Number of LABs/CLBs	392	1395
Number of Logic Elements/Cells	6272	22320
Total RAM Bits	276480	608256
Number of I/O	179	153
Voltage - Supply	1.15V ~ 1.25V	0.97V ~ 1.03V
Mounting Type	Surface Mount	Surface Mount
Operating Temperature	0°C ~ 85°C (TJ)	-40°C ~ 100°C (TJ)

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