EP4CE115F23I7N vs EP4CE6F17C8N

This in-depth comparison of the EP4CE115F23I7N and EP4CE6F17C8N provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

EP4CE115F23I7N

Intel

Lifecycle: Active
Stock: 6446 PCS
Package: FBGA-484
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

Part B

EP4CE6F17C8N

Intel

Lifecycle: Active
Stock: 3396 PCS
Package: BGA-256
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	EP4CE115F23I7N	EP4CE6F17C8N
Series	Cyclone® IV E	Cyclone® IV E
Part Status	Active	Active
Number of LABs/CLBs	7155	392
Number of Logic Elements/Cells	114480	6272
Total RAM Bits	3981312	276480
Number of I/O	280	179
Voltage - Supply	1.15V ~ 1.25V	1.15V ~ 1.25V
Mounting Type	Surface Mount	Surface Mount
Operating Temperature	-40°C ~ 100°C (TJ)	0°C ~ 85°C (TJ)

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