EPF6016TC144-3 vs EPF6016QI208-3

This in-depth comparison of the EPF6016TC144-3 and EPF6016QI208-3 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

EPF6016TC144-3

Intel

Lifecycle: Active
Stock: 5570 PCS
Package: TQFP-144
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

Part B

EPF6016QI208-3

Intel

Lifecycle: Active
Stock: 9846 PCS
Package: BFQFP-208
Series: Embedded - FPGAs (Field Programmable Gate Array)

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	EPF6016TC144-3	EPF6016QI208-3
Supplier	-	Intel
Series	FLEX 6000	FLEX 6000
Part Status	Obsolete	Obsolete
Number of LABs/CLBs	132	132
Number of Logic Elements/Cells	1320	1320
Number of I/O	117	171
Number of Gates	16000	16000
Voltage - Supply	4.75V ~ 5.25V	4.5V ~ 5.5V
Mounting Type	Surface Mount	Surface Mount
Operating Temperature	0°C ~ 85°C (TJ)	-40°C ~ 100°C (TJ)

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