FDD8896 vs FDD8880

This in-depth comparison of the FDD8896 and FDD8880 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

FDD8896

onsemi

Lifecycle: Active
Stock: 4510 PCS
Package: TO-252-3
Series: Transistors - FETs, MOSFETs - Single

+BOM RFQ

Part B

FDD8880

onsemi

Lifecycle: Active
Stock: 6387 PCS
Package: TO-252-3
Series: Transistors - FETs, MOSFETs - Single

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	FDD8896	FDD8880
Series	PowerTrench®	PowerTrench®
Part Status	Active	Active
FET Type	N-Channel	N-Channel
Technology	MOSFET (Metal Oxide)	MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss)	30 V	30 V
Current - Continuous Drain(Id) @ 25°C	17A (Ta), 94A (Tc)	13A (Ta), 58A (Tc)
Drive Voltage(Max Rds On Min Rds On)	4.5V, 10V	4.5V, 10V
Rds On(Max) @ Id Vgs	5.7mOhm @ 35A, 10V	9mOhm @ 35A, 10V
Vgs(th)(Max) @ Id	2.5V @ 250µA	2.5V @ 250µA
Gate Charge(Qg)(Max) @ Vgs	60 nC @ 10 V	31 nC @ 10 V
Vgs(Max)	±20V	±20V
Input Capacitance(Ciss)(Max) @ Vds	2525 pF @ 15 V	1260 pF @ 15 V
Power Dissipation (Max)	80W (Tc)	55W (Tc)
Operating Temperature	-55°C ~ 175°C (TJ)	-55°C ~ 175°C (TJ)
Mounting Type	Surface Mount	Surface Mount

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